Patent classifications
H01L31/024
Semiconductor device comprising a monitor including a second semiconductor layer in which dark current is changed by a heater
An optical semiconductor element includes an optical receiver including a first semiconductor layer, a heater for heating the first semiconductor layer; and a monitor. A first semiconductor layer that absorbs light and generates electric carriers; a heater for heating the first semiconductor layer; and a monitor including a second semiconductor layer in which dark current is changed by heat generated by the heater.
PHOTODETECTOR WITH RESONANT WAVEGUIDE STRUCTURE
Disclosed is a photodetector with a resonant waveguide structure, including: a substrate; a light absorption layer located on the substrate and configured for detecting an optical signal; a resonant waveguide structure including a first waveguide portion and a second waveguide portion spaced apart; the first waveguide portion receives the optical signal and transmits the received optical signal to a first region of the second waveguide portion, the second waveguide portion includes a second region for coupling the optical signal to the light absorption layer, and the second waveguide portion provides a circular transmission path for transmission of the optical signal to transmit the optical signal that transmitted to the first region to the second region along part of the circular transmission path and retransmit the optical signal that flows through the second region without being coupled to the light absorption layer to the second region along the circular transmission path.
PHOTODETECTOR WITH RESONANT WAVEGUIDE STRUCTURE
Disclosed is a photodetector with a resonant waveguide structure, including: a substrate; a light absorption layer located on the substrate and configured for detecting an optical signal; a resonant waveguide structure including a first waveguide portion and a second waveguide portion spaced apart; the first waveguide portion receives the optical signal and transmits the received optical signal to a first region of the second waveguide portion, the second waveguide portion includes a second region for coupling the optical signal to the light absorption layer, and the second waveguide portion provides a circular transmission path for transmission of the optical signal to transmit the optical signal that transmitted to the first region to the second region along part of the circular transmission path and retransmit the optical signal that flows through the second region without being coupled to the light absorption layer to the second region along the circular transmission path.
Semiconductor package and method of fabricating the same
A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.
Semiconductor package and method of fabricating the same
A semiconductor package including a substrate, a memory chip on the substrate, a mold layer on the substrate to cover a side surface of the memory chip, an image sensor chip on the memory chip and the mold layer, and a connection terminal between and electrically connecting the memory chip to the image sensor chip may be provided.
IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY
An image sensor comprises an array of sensor elements, each responsive to incident photon flux, and a readout circuit coupled electronically to the array of sensor elements and configured to release an electronic signal varying in dependence on the incident photon flux. A thermal-barrier zone separates the array of sensor elements from the readout circuit, and a solid-state cooler is coupled thermally to the array of sensor elements.
IMAGE SENSOR WITH ACTIVELY COOLED SENSOR ARRAY
An image sensor comprises an array of sensor elements, each responsive to incident photon flux, and a readout circuit coupled electronically to the array of sensor elements and configured to release an electronic signal varying in dependence on the incident photon flux. A thermal-barrier zone separates the array of sensor elements from the readout circuit, and a solid-state cooler is coupled thermally to the array of sensor elements.
DETECTION DEVICE
A detection device includes a photoelectric conversion portion in which a plurality of photodiodes are arranged in a planar shape, a light source configured to irradiate the photodiodes with light, and a heating electrode provided so as to face the photoelectric conversion portion, and configured to generate heat and conduct the heat to the photoelectric conversion portion.
DETECTION DEVICE
A detection device includes a photoelectric conversion portion in which a plurality of photodiodes are arranged in a planar shape, a light source configured to irradiate the photodiodes with light, and a heating electrode provided so as to face the photoelectric conversion portion, and configured to generate heat and conduct the heat to the photoelectric conversion portion.
Structures for passive radiative cooling
Passive radiative cooling structures and apparatus manufactured with such cooling structures conserve energy needs. A flexible film transparent to visible light incorporates particles at a volume percentage larger than 25% so as to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent. Another film transparent to visible light is thin and flexible and configured to absorb and emit infrared radiation at wavelengths where Earth's atmosphere is transparent, wherein etchings or depositions are present on one or both surfaces. A high efficiency cooling structure has an emissive layer sandwiched between a waveguide layer and a thermal conductive layer. A solar cell panel is covered by a transparent passive radiative cooling film. A container housing an active cooling unit incorporates passive radiative cooling structures on one or more exterior surfaces.