A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

The present disclosure relates to an energy harvesting technology for generating electrical energy by using a combination of a solar cell and a thermoelectric device. An energy harvesting system according to one embodiment of the present disclosure may include a solar cell for generating electrical energy based on sunlight; a heat transfer layer formed on at least one edge portion of the upper surface of the solar cell on which sunlight is incident; and a thermoelectric device including a first electrode, a second electrode, a thermoelectric channel disposed between the first and second electrodes, having a horizontal structure in which the first electrode is disposed on the heat transfer layer to be arranged horizontally with respect to the solar cell, and configured to generate additional electrical energy based on the temperature difference between the first and second electrodes.

The invention relates to a hybrid solar panel comprising: a photovoltaic module; a heat exchanger arranged opposite in the rear surface of said photovoltaic module; a cooling fluid circulating in said exchanger; the heat exchanger including a heat exchange area; inner channels extending over the entire surface of the exchange area; the heat exchange area is made up of a double cellular plate with cells provided in the form of adjacent inner channels in fluid communication with the intake and discharge areas, characterised in that: the side ends are sealed; the plate comprises openings made in the lower wall in order to establish fluid communication between each channel and the intake and discharge areas, respectively; and the intake and discharge areas are provided in the form of collectors placed on the lower wall at the openings, so that said upper wall remains planar over the entire surface thereof.

The present invention relates to a solar panel to which a high-damping stacked reinforcement part is applied and, more specifically, to a solar panel to which a high-damping stacked reinforcement part is applied, comprising: a power generation unit for generating electrical energy; a coupling part to which the power generation unit is coupled, and which has a circuit formed therein; and a reinforcement part for reinforcing the rigidity of the coupling part and damping vibration to be transmitted, and thus the present invention can prevent the power generation unit from being damaged by vibration, or the solar panel from inducing wobbling of a satellite by failing to damp the vibration.

The present disclosure relates to compound parabolic concentrators. In one implementation, a compound parabolic concentrator may include a parabolic array having a base, a side wall, and an aperture for receiving light and a dielectric layer having a refractive index. In another implementation, a stacked compound parabolic concentrator may include a parabolic array having a base, a side wall, and an aperture for receiving light and multiple dielectric layers within the array. Each dielectric layer may have a refractive index, and the refractive index may decrease with each dielectric layer moving from the base of the parabolic array to the light receiving aperture.

The present disclosure relates to compound parabolic concentrators. In one implementation, a compound parabolic concentrator may include a parabolic array having a base, a side wall, and an aperture for receiving light and a dielectric layer having a refractive index. In another implementation, a stacked compound parabolic concentrator may include a parabolic array having a base, a side wall, and an aperture for receiving light and multiple dielectric layers within the array. Each dielectric layer may have a refractive index, and the refractive index may decrease with each dielectric layer moving from the base of the parabolic array to the light receiving aperture.

A radiatively cooled solar array, including a downwardly-facing solar cell and a mirror positioned below the solar cell and oriented to direct sunlight onto the solar cell. The assembly also includes a heat sink in thermal communication with the solar cell and disposed opposite the mirror. The heat sink is in radiative communication through Earth's atmosphere with outer space.

A radiatively cooled solar array, including a downwardly-facing solar cell and a mirror positioned below the solar cell and oriented to direct sunlight onto the solar cell. The assembly also includes a heat sink in thermal communication with the solar cell and disposed opposite the mirror. The heat sink is in radiative communication through Earth's atmosphere with outer space.

An energy conversion device for conversion of various energy forms into electricity. The energy forms may be chemical, photovoltaic or thermal gradients. The energy conversion device has a first and second electrode. A substrate is present that has a porous semiconductor or dielectric layer placed thereover. The substrate itself can be planar, two-dimensional, or three-dimensional, and possess internal and external surfaces. These substrates may be rigid, flexible and/or foldable. The porous semiconductor or dielectric layer can be a nano-engineered structure. A porous conductor material is placed on at least a portion of the porous semiconductor or dielectric layer such that at least some of the porous conductor material enters the nano-engineered structure of the porous semiconductor or dielectric layer, thereby forming an intertwining region.

An energy conversion device for conversion of various energy forms into electricity. The energy forms may be chemical, photovoltaic or thermal gradients. The energy conversion device has a first and second electrode. A substrate is present that has a porous semiconductor or dielectric layer placed thereover. The substrate itself can be planar, two-dimensional, or three-dimensional, and possess internal and external surfaces. These substrates may be rigid, flexible and/or foldable. The porous semiconductor or dielectric layer can be a nano-engineered structure. A porous conductor material is placed on at least a portion of the porous semiconductor or dielectric layer such that at least some of the porous conductor material enters the nano-engineered structure of the porous semiconductor or dielectric layer, thereby forming an intertwining region.