An optical sensor device, a method for fabricating the same, and a display device are disclosed. The optical sensor device includes a display region and a non-display region. In the display non-display region, the optical sensor device includes a thin film transistor, including an active layer, a gate insulating layer, a gate layer, a source and drain layer, and an interlayer dielectric layer. In the non-display display region, the optical sensor device includes a first insulating layer, a conductive layer and a second insulating layer which are stacked sequentially. The conductive layer is arranged in a same layer as the source and drain layer or the gate layer. In the non-display display region, the first insulating layer is provided with a first through-hole, and the optical sensor device further includes a photo-sensitive device in the first through-hole.

An optical sensor device, a method for fabricating the same, and a display device are disclosed. The optical sensor device includes a display region and a non-display region. In the display non-display region, the optical sensor device includes a thin film transistor, including an active layer, a gate insulating layer, a gate layer, a source and drain layer, and an interlayer dielectric layer. In the non-display display region, the optical sensor device includes a first insulating layer, a conductive layer and a second insulating layer which are stacked sequentially. The conductive layer is arranged in a same layer as the source and drain layer or the gate layer. In the non-display display region, the first insulating layer is provided with a first through-hole, and the optical sensor device further includes a photo-sensitive device in the first through-hole.

An electronic device can include a housing defining an aperture, and an electromagnetic radiation emitter and an electromagnetic radiation detector disposed in the housing. An optical component can be disposed in the aperture and can include a first region of a first material having a first index of refraction, the first region aligned with the electromagnetic radiation emitter, a second region of the first material, the second region aligned with the electromagnetic radiation detector, and a bulk region surrounding a periphery of the first region and a periphery of the second region, the bulk region including a second material having a second index of refraction that is lower than the first index of refraction.

A photoelectric conversion element for detecting the spot size of incident light, including a photoelectric conversion substrate provided with two main surfaces, and multiple first sensitivity sections and second sensitivity sections arranged in a prescribed direction. When sensitivity regions on the respective main surfaces of the multiple first sensitivity sections are defined as first sensitivity regions, and sensitivity regions that appear on the main surfaces of the second sensitivity sections are defined as second sensitivity regions, each of the first sensitivity regions receives at least a part of light incident on the main surfaces, and has a pattern in which, in accordance with enlargement of an irradiation region irradiated with incident light on the main surface, the proportion of the first sensitivity regions in the irradiation region with respect to the first sensitivity regions other than those in the irradiation region and the second sensitivity regions is decreased.

A photoelectric conversion element for detecting the spot size of incident light, including a photoelectric conversion substrate provided with two main surfaces, and multiple first sensitivity sections and second sensitivity sections arranged in a prescribed direction. When sensitivity regions on the respective main surfaces of the multiple first sensitivity sections are defined as first sensitivity regions, and sensitivity regions that appear on the main surfaces of the second sensitivity sections are defined as second sensitivity regions, each of the first sensitivity regions receives at least a part of light incident on the main surfaces, and has a pattern in which, in accordance with enlargement of an irradiation region irradiated with incident light on the main surface, the proportion of the first sensitivity regions in the irradiation region with respect to the first sensitivity regions other than those in the irradiation region and the second sensitivity regions is decreased.

An optical semiconductor device includes a semiconductor light receiving element, a capacitor, and a carrier. The carrier has a mounting surface on which the semiconductor light receiving element and the capacitor are mounted. The optical semiconductor device includes a first conductive pattern including a first mounting area and a first bonding pad, a second conductive pattern including a second mounting area and a third mounting area, and a third conductive pattern including a second bonding pad. The first mounting area is connected to a first electrode of the semiconductor light receiving element. The second mounting area is connected to a second electrode of the semiconductor light receiving element. The third mounting area is connected to one electrode of the capacitor. The conductive patterns are separated from each other. The other electrode of the capacitor is electrically connected to the third conductive pattern via a wire.

An optical semiconductor device includes a semiconductor light receiving element, a capacitor, and a carrier. The carrier has a mounting surface on which the semiconductor light receiving element and the capacitor are mounted. The optical semiconductor device includes a first conductive pattern including a first mounting area and a first bonding pad, a second conductive pattern including a second mounting area and a third mounting area, and a third conductive pattern including a second bonding pad. The first mounting area is connected to a first electrode of the semiconductor light receiving element. The second mounting area is connected to a second electrode of the semiconductor light receiving element. The third mounting area is connected to one electrode of the capacitor. The conductive patterns are separated from each other. The other electrode of the capacitor is electrically connected to the third conductive pattern via a wire.

An optical coupling device includes a leadframe, a light-emitter, a light-receiver, and first to fourth resins. The light-emitter is located on the leadframe. The first resin is located on the leadframe. The first resin includes first and second portions. The first portion surrounds the light-emitter. The second portion is positioned between the first portion and the light-emitter. A first thickness of the first portion is greater than a second thickness of the second portion. The second resin is located between the light-emitter and the light-receiver in the first direction and is light-transmissive. The third resin is located between the second resin and the light-receiver and is light-transmissive. The fourth resin houses the light-emitter, the light-receiver, and the first to third resins and is light-shielding.

The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.

The present disclosure provides an optical sensor, an optical distance sensing module and a fabricating method thereof. According to the embodiments of the present disclosure, the optical sensor includes an optical sensing layer, a light transmitting layer and a light blocking layer. The optical sensing layer includes an array of optical sensing elements, the light transmitting layer is coated on the optical sensing layer, and the light blocking layer includes one or more light incident holes and is coated on the light transmitting layer. The optical sensing layer, the light transmitting layer and the light blocking layer are packaged as a wafer die. Light passes through the light incident holes and transmits through the light transmitting layer to irradiate on the array of optical sensing elements. The optical sensor effectively reduces the thickness, size and weight of the optical sensor, thereby expanding the application range of the optical sensor.