A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that holds the light diffusing member and is provided on a wire connected to the light source so as to be located in an uncoated region of the wire.

A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.

A device includes a substrate and an optoelectronic chip buried in the substrate. The substrate may include an opening above a first optical transduction region of the first optoelectronic chip and above a second optical transduction region of a second optoelectronic chip.

An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.

Technologies for chip-to-chip optical data transfer are disclosed. In the illustrative embodiment, microLEDs on a first chip are used to send data to microphotodiodes on a second chip. The beams from the microLEDs may be sent to the microphotodiodes using an optical bridge, microprisms, a channel through a substrate, a channel defined in a substrate, etc. The microLEDs may be used for high-speed data transfer with low power usage. A chip may include a relatively large number of microLEDs and/or microphotodiodes, allowing for a large bandwidth connection. MicroLEDs and microphotodiodes may be used to connect different parts of the same chip, different chips on the same package, different packages on the same device, or different chips on different devices.

A display panel including a first current source and a first pixel unit is provided. The first pixel unit includes a first switch and a first light-emitting diode. The first switch is coupled to the first current source and receives a first scan signal. When the first scan signal is enabled, the first switch is turned on and receives a first current provided by the first current source. The first light-emitting diode is coupled to the first switch. When the first switch is turned on, the first current passes through the first light-emitting diode to turn on the first light-emitting diode.

A display panel including a first current source and a first pixel unit is provided. The first pixel unit includes a first switch and a first light-emitting diode. The first switch is coupled to the first current source and receives a first scan signal. When the first scan signal is enabled, the first switch is turned on and receives a first current provided by the first current source. The first light-emitting diode is coupled to the first switch. When the first switch is turned on, the first current passes through the first light-emitting diode to turn on the first light-emitting diode.

Provided are a heat-curable silicone resin composition for primarily encapsulating photocoupler that is superior in heat resistance and curability, has no stain at the time of being molded and after being cured, and exhibits a small change in a light transmissibility; a photocoupler encapsulated by such composition; and an optical semiconductor device having such photocoupler. The heat-curable silicone resin composition contains (A) a condensation reaction-type resinous organopolysiloxane solid at 25° C.; (B) an organopolysiloxane having a linear diorganopolysiloxane residue, and at least one cyclohexyl group or phenyl group in one molecule; (C) an inorganic filler; (D) an organic metal-based condensation catalyst; (E) a zirconium-carrying ion trapping agent; and (F) a mold release agent.

Provided are a heat-curable silicone resin composition for primarily encapsulating photocoupler that is superior in heat resistance and curability, has no stain at the time of being molded and after being cured, and exhibits a small change in a light transmissibility; a photocoupler encapsulated by such composition; and an optical semiconductor device having such photocoupler. The heat-curable silicone resin composition contains (A) a condensation reaction-type resinous organopolysiloxane solid at 25° C.; (B) an organopolysiloxane having a linear diorganopolysiloxane residue, and at least one cyclohexyl group or phenyl group in one molecule; (C) an inorganic filler; (D) an organic metal-based condensation catalyst; (E) a zirconium-carrying ion trapping agent; and (F) a mold release agent.

A method to fill the flowable material into the semiconductor assembly module gap regions is described. In an embodiment, multiple semiconductor units are formed on the substrate to create an array module; the array module is attached to a backplane having circuitry to form the semiconductor assembly module in which multiple gap regions are formed inside the semiconductor assembly module and edge gap regions are formed surround an edge of the assembly module; The flowable material is forced inside the gap regions by performing the high acting pressure environment and then cured to be a stable solid to form a robustness structure. A semiconductor convert module is formed by removing the substrate utilizing a substrate removal process. A semiconductor driving module is formed by utilizing a connecting layer on the semiconductor convert module. In one embodiment, a vertical light emitting diode semiconductor driving module is formed to light up the vertical LED array. In another one embodiment, multiple color emissive light emitting diodes semiconductor driving module is formed to display color images. In another embodiment, multiple patterns of semiconductor units having multiple functions semiconductor driving module is formed to provide multiple functions for desire application.