An optical receiver module includes a light receiving element that has a first electrode and a second electrode for receiving a bias and converts an optical signal inputted into an electrical signal to output the electrical signal via the first electrode. A signal line extends from the first electrode through the light receiving element-side signal pad and the second wire to the amplifier-side signal pad. A bias line extends from the second electrode through the light receiving element-side bias pad, the first wire, and the third wire to the first and second amplifier-side bias pads. The signal line three-dimensionally intersects with the bias line at an interval in a direction of the loop height of the first wire and that of the second wire.

In one embodiment, a photo detector is provided with a semiconductor layer having a first light receiving surface and a second light receiving surface opposite to the first light receiving surface, and a diffraction grating which is provided on the first light, receiving surface side of the semiconductor layer and has convex portions. The convex portions are arranged in one direction at a predetermined cycle.

An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.

An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.

One or more stud bumps may form a conductive column to a component having back side metallization. In an embodiment, the column of stud bumps may be about 130 um vertically (Z-direction). Providing a microelectronics package with a column of stud bumps electrically connected to a component having back side metallization may provide a cost effective electrical interconnect and may enable the incorporation of components of different thicknesses, including that the component thicknesses are independent of each other, in a single fanout package, while providing a thin package profile and back side surface finish integration.

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

We disclose a chemical sensing device for detecting a fluid. The sensing device comprises: at least one substrate region comprising at least one etched portion; a dielectric region formed on the at least one substrate region, the dielectric region comprising at least one dielectric membrane region adjacent to the at least one etched portion; an optical source for emitting an infra-red (IR) signal; an optical detector for detecting the IR signal emitted from the optical source; one or more further substrates formed on or under the dielectric region, said one or more further substrates defining an optical path for the IR signal to propagate from the optical source to the optical detector. At least one of the optical source and optical detector is formed in or on the dielectric membrane region.

We disclose a chemical sensing device for detecting a fluid. The sensing device comprises: at least one substrate region comprising at least one etched portion; a dielectric region formed on the at least one substrate region, the dielectric region comprising at least one dielectric membrane region adjacent to the at least one etched portion; an optical source for emitting an infra-red (IR) signal; an optical detector for detecting the IR signal emitted from the optical source; one or more further substrates formed on or under the dielectric region, said one or more further substrates defining an optical path for the IR signal to propagate from the optical source to the optical detector. At least one of the optical source and optical detector is formed in or on the dielectric membrane region.

A sensor includes a light emitting element, a photodetector element for receiving light emitted by the light emitting element, and a circuit board having the light emitting element and the photodetector element mounted thereon. A light emitting surface of the light emitting element is facing the circuit board which is provided with a light-transmitting portion for transmitting the light emitted by the light emitting element.