A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

A solar panel disassembling apparatus for disassembling a solar panel including a glass plate and a stacked film, includes a supporting plate of which is in contact with the glass plate, a moving scraper module including a first body moving in parallel with the supporting plate, a first elevator moving vertically, and a blade connected to the first elevator and changing in height and scraping the stacked film using the blade, and a moving pressing module including a second body moving in parallel with the supporting plate, a second elevator vertically, and a pressing unit connected to the second elevator and changing in height. The moving pressing module is disposed forward in the forward movement direction of the moving scraper module and presses and aligns the stacked film using the pressing unit ahead of the moving scraper module.

A semiconductor device has a substrate. A semiconductor die with a photosensitive circuit is disposed over the substrate. A lens comprising a protective layer is disposed over the photosensitive circuit. An encapsulant is deposited over the substrate, semiconductor die, and lens. The protective layer is removed after depositing the encapsulant.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

This specification describes automated reel processes for producing solar modules and solar module reels. In some examples, a method includes receiving a continuous feed of photovoltaic devices on a photovoltaic device sheet. The method includes locating and bypassing one or more defective photovoltaic devices on the photovoltaic device sheet. The method includes installing bussing for the photovoltaic devices on the photovoltaic device sheet. The method includes feeding the photovoltaic device sheet to an encapsulation system to output a photovoltaic module sheet.

A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.

Provided is a solar cell, including: an N-type semiconductor substrate having a front surface and a rear surface opposite to the front surface; a boron diffusion layer arranged on the front surface of the N-type semiconductor substrate, a first passivation layer is provided on a surface of the boron diffusion layer, and a first electrode is provided passing through the first passivation layer to form an electrical connection with the N-type semiconductor substrate; and a phosphorus-doped polysilicon layer arranged on the rear surface of the N-type semiconductor substrate. A silicon oxide layer containing nitrogen and phosphorus is provided between the rear surface of the N-type semiconductor substrate and the phosphorus-doped polysilicon layer, a second passivation layer is provided on a surface of the phosphorus-doped polysilicon layer, and a second electrode is provided passing through the second passivation layer to form an electrical connection with the phosphorus-doped polysilicon layer.

In an embodiment a method for singulating components from a component composite includes providing the component composite comprising a structured substrate including component carrier bodies and connecting portions arranged between the component carrier bodies, and a base material, in which the connecting portions of the structured substrate are at least partially embedded, removing the base material in separating regions of the component composite, which include the connecting portions and singulating the component composite at the separating regions to form the components.

Embodiments of the disclosure provide a method for forming an optical sensing device for a receiver in an optical sensing system. According to the method, a light concentrator is formed in a carrier wafer. The carrier wafer is bonded with a detector wafer. The detector wafer has a photodetector such that the light concentrator aligns with and covers the photodetector. A portion of the carrier wafer is removed to expose the light concentrator and the photodetector.

A system for wafer processing, includes: a frame comprising a frame opening; and a membrane configured to couple to the frame and to cover at least a part of the frame opening, the membrane comprising a membrane opening, wherein the membrane opening has a membrane opening area that is equal to or less than a frame opening area of the frame opening; wherein the membrane is configured for coupling with the wafer, wherein when the wafer is coupled with the membrane, the wafer covers the membrane opening, and wherein the membrane is configured to maintain the wafer at a certain position with respect to the frame; and wherein the membrane opening area is less than a total area of the wafer.