A display device includes a circuit board including a first circuit portion, a second circuit portion, and a third circuit portion, a first display panel on the first circuit portion, and configured to emit a first light, a second display panel on the second circuit portion, and configured to emit a second light, a third display panel on the third circuit portion, and configured to emit a third light, and an optical combiner configured to combine the first light, the second light, and the third light to output a light.

An optoelectronic semiconductor device may include a semiconductor layer sequence, a directionally reflective layer being arranged on the first main surface of the semiconductor layer sequence, a first contact structure comprising a first current spreading structure arranged on a first surface of a first semiconductor layer of the semiconductor layer sequence, a second contact structure comprising a second current spreading structure arranged on a first surface of a second semiconductor layer of the layer stack, wherein the first current spreading structure and the second current spreading structure each consist of at least one transparent conductive oxide. Moreover, a method for producing an optoelectronic semiconductor device is described.

An optoelectronic semiconductor device may include a semiconductor layer sequence, a directionally reflective layer being arranged on the first main surface of the semiconductor layer sequence, a first contact structure comprising a first current spreading structure arranged on a first surface of a first semiconductor layer of the semiconductor layer sequence, a second contact structure comprising a second current spreading structure arranged on a first surface of a second semiconductor layer of the layer stack, wherein the first current spreading structure and the second current spreading structure each consist of at least one transparent conductive oxide. Moreover, a method for producing an optoelectronic semiconductor device is described.

A semiconductor light emitting device includes a conductive substrate and a first metal layer disposed on the substrate. The first metal layer is formed so as to be electrically connected with the substrate, and the first metal layer includes an Au based material. A joining layer is formed on the first metal layer. The joining layer includes a second metal layer including Au and a third metal layer including Au. A metallic contact layer and an insulating layer are formed on the joining layer. A semiconductor layer is formed on the metallic contact layer and the insulating layer and includes a red-based light emitting layer. An electrode is formed on the semiconductor layer and is made of metal. The insulating layer includes a patterned aperture, and at least a part of the metallic contact layer is formed in the aperture.

A semiconductor light-emitting element includes: an n-type semiconductor layer made of an n-type AlGaN-based semiconductor material; an active layer provided on the n-type semiconductor layer and made of an AlGaN-based semiconductor material; a p-type semiconductor layer provided on the active layer; a p-side contact electrode that includes a Rh layer in contact with an upper surface of the p-type semiconductor layer; a p-side electrode covering layer that is in contact with an upper surface and a side surface of the p-side contact electrode and includes a Ti layer, a Rh layer, and a TiN layer stacked successively; a dielectric covering layer that has a connection opening provided on the p-side electrode covering layer and covers the p-side electrode covering layer in a portion different from the connection opening; and a p-side current diffusion layer that connects to the p-side electrode covering layer in the connection opening.

Provided is a semiconductor light emitting element including a semiconductor stacked structure having a projecting portion from which light is emitted, an insulating layer provided on a side face of the projecting portion and a bottom face on a periphery of the projecting portion, a transparent electrode provided on a top face of the projecting portion and on at least part of a front surface of the insulating layer, and an electrode covering the bottom face on the periphery of the projecting portion and covering at least part of the transparent electrode provided on the front surface of the insulating layer.

Provided is a semiconductor light emitting element including a semiconductor stacked structure having a projecting portion from which light is emitted, an insulating layer provided on a side face of the projecting portion and a bottom face on a periphery of the projecting portion, a transparent electrode provided on a top face of the projecting portion and on at least part of a front surface of the insulating layer, and an electrode covering the bottom face on the periphery of the projecting portion and covering at least part of the transparent electrode provided on the front surface of the insulating layer.

A high-voltage flip-chip semiconductor light-emitting device includes a substrate, at least two semiconductor light-emitting units, an isolation trench, a conducting layer, an isolating layer, a connecting layer, and a Bragg reflection layer. The semiconductor light-emitting units and the conducting layer are sequentially disposed on the substrate. The isolation trench is formed between the semiconductor light-emitting units. The isolating layer partially covers the conducting layer. The connecting layer is disposed on the isolating layer and electrically connects the semiconductor light-emitting units. The Bragg reflection layer covers the connecting layer and the isolating layer.

This specification discloses LEDs and LED arrays configured such that an electric field may be applied during operation of the device to drive charge carriers (electrons or holes) away from perimeter semiconductor surfaces of the LEDs, thereby reducing non-radiative recombination near those perimeter surfaces. These LEDs and LED arrays comprise (e.g., metal) field plates, arranged around the perimeter surfaces of the LEDs, by which the electric field may be applied. In some variations, the bias voltage applied to the field plates to produce the electric fields may be separately controlled for some, or each, LED in an array. In other variations the bias applied to the field plates is the same for each LED in an array.

An improved heterostructure for an optoelectronic device is provided. The heterostructure includes an active region, an electron blocking layer, and a p-type contact layer. The heterostructure can include a p-type interlayer located between the electron blocking layer and the p-type contact layer. In an embodiment, the electron blocking layer can have a region of graded transition. The p-type interlayer can also include a region of graded transition.