A light emitting diode lighting system has a base arranged as a cylinder further comprising a pair of arcuate extensions having a pair of arcuate openings therebetween. Electrical tracks are joined to the base. A semiconductor substrate is arranged around an out surface of the base and connected to the electrical tracks. A polymeric housing is joined to the base and housing the electrical tracks. A germanium layer and a silicon layer are joined to the semiconductor substrate. An outer layer is joined to the germanium layer and the silicon layer and configured to dissipate heat from the germanium layer and the silicon layer. An outer module is joined to the outer layer, and configured to mount the light emitting diode lighting system into an external housing.

The invention relates to a component (100) having an electrically insulating and radiation-transparent substrate (9) and at least one semiconductor chip (10) arranged on the substrate (9). The semiconductor chip (10) is designed to generate electromagnetic radiation and has a front side (11) and a rear side (12) facing away from the front side (11), wherein the front side (11) of the semiconductor chip (10) faces the substrate (9) and is designed as a radiation exit face of the semiconductor chip (10), and wherein the rear side (12) of the semiconductor chip (10) faces away from the substrate (9), wherein the semiconductor chip (10) can be electrically contacted externally via the rear side (12). The invention further relates to a method for producing such a component.

A display device is provided. The display device includes a plurality of pixels disposed in a display area, each of the plurality of pixels includes a first electrode and a second electrode spaced apart from each other in a first direction, and at least one light emitting element disposed between the first electrode and the second electrode and electrically connected to the first electrode and the second electrode, and a distance in the first direction between one end of the light emitting element and one end of the second electrode is greater than a distance in the first direction between another end of the light emitting element and one end of the first electrode.

A display device includes a first barrier wall and a second barrier wall spaced from each other on a substrate; a first electrode on the first barrier wall and extending in a first direction; a second electrode on the second barrier wall and spaced from the first electrode in a second direction, the second electrode extending in the first direction; and light emitting elements between the first and second barrier walls and on the first electrode and the second electrode, wherein the first barrier wall includes a first portion and a second portion that is located further from the second barrier wall than the first portion is, and the second barrier wall includes a third portion opposing the first portion and a fourth portion that is located further from the first barrier wall than the third portion is.

A light emitting device including a housing including walls defining a cavity having one side thereof opened, a light emitter to emit light having a peak wavelength in a blue wavelength band and including first and second light emitting chips, a reflective region in the housing to reflect light, and a wavelength conversion layer disposed on the light emitter and including a first wavelength converter and a second wavelength converter to emit light having different peak wavelengths from each other, in which the first wavelength converter has a first excitation peak wavelength and the second wavelength converter has a second excitation peak wavelength, and the second wavelength converter includes a fluoride-based red phosphor represented by A.sub.2MF.sub.6:Mn.sup.4+, where A is one of Li, Na, K, Ba, Rb, Cs, Mg, Ca, Se, and Zn, and M is one of Ti, Si, Zr, Sn, and Ge.

An electronic device is provided by the present disclosure. The electronic device includes a substrate, a light emitting diode and an optical sensor. The light emitting diode is disposed on the substrate and emits a light. The optical sensor is disposed on the substrate and is configured to receive the light, and the optical sensor receives the light to generate a first electrical signal for fingerprint authentication, and receives the light to generate a second electrical signal for luminance calibration of the light.

An optoelectronic device comprises an epitaxial stack, comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a trench exposing a portion of the first semiconductor layer; a first insulating layer formed on a side wall of the trench to electrically insulate from the active layer and the second semiconductor layer; a first electrode formed on the trench; a second electrode formed on the second semiconductor layer; a supporting device covering the epitaxial stack; an optical layer covering the first electrode and the second electrode, comprising a plurality of openings corresponding to positions of the first electrodes and the second electrodes; a fifth electrode electrically connected with the first electrode; and a sixth electrode electrically connected with the second electrode, wherein the fifth electrode and the sixth electrode each comprises a side comprising a length longer that of an edge of the epitaxial stack.

A semiconductor light-emitting device includes a first bonding pattern made of metal that is formed on a substrate, and a second bonding pattern provided in a base portion and a flange portion of a dome-shaped transparent body. The first and second bonding patterns are bonded to each other via solder, to seal a space in a convex lid portion. The first and second bonding patterns have rectangular ring shapes that surround the semiconductor light-emitting element when viewed from above, at least edges on inner peripheral sides of corner portions thereof are positioned on outer sides of outer peripheral edges of an annular base portion of the convex lid portion, and edges on inner peripheral sides of straight-line portions sandwiched between the corner portions are positioned closer to the semiconductor light-emitting element than the outer peripheral edge of the annular base portion of the convex lid portion.

A manufacturing method of a reflective display includes at least the following steps. A reflective display module having a display surface is provided. An adhesive is formed on the display surface of the reflective display module. A plurality of microstructures is formed on the adhesive. A cover plate is provided over the reflective display module, the microstructures, and the adhesive. The cover plate has a first surface, a second surface, and a third surface. The second surface is located between the first surface and the reflective display module, and the third surface is connected to the first surface and the second surface. The second surface of the cover plate is adhered to the adhesive having the microstructures thereon to bond the microstructures onto the second surface of the cover plate. A light source is disposed adjacent to the third surface of the cover plate.

A light-emitting device includes a component-mounting body including a first surface including a recess, and a light emitter mounted in the recess. The component-mounting body allows at least part of light emitted from the light emitter to be reflected from an inner peripheral surface of the recess at least twice.