A light emitting device includes: a base body including two conductive members, a resin body, and a fiber member placed inside the resin body, and a light-emitting element. The resin body includes an isolation section located between the two conductive members, and includes a pair of sandwiching portions sandwiching the isolation section. The fiber member has a length which is greater than a distance between the two conductive members, and is located at least in an adjoining region of at least one of the pair of sandwiching portions, the adjoining region adjoining the isolation section. In the adjoining region, the fiber member extends in a direction which is non-orthogonal to a direction in which that the pair of sandwiching portions extend.

Disclosed herein is a lense module. A lens module according to an exemplary embodiment of the present disclosure includes a substrate having a plurality of light emitting regions, a light emitting devices provided in each of the plurality of light emitting regions to emit light, and a lens unit provided on the substrate to cover the light emitting devices, a glue contacting the substrate and the lens unit to secure the substrate and the lens unit, and a support member provided in the glue and mounted on the substrate. The support member includes a hump for increasing a contact area between the support member and the glue, and a clip connected to the lens unit.

A light-emitting module includes: a lightguide plate having a main surface and including a plurality of unit regions including at least one first unit region and a plurality of second unit regions, the lightguide plate including a plurality of first recesses in the main surface; a plurality of light sources provided at the main surface, each of the light sources being located in the first recess so as to correspond to one of the unit regions; and a light-transmitting member provided in the first recess of each of the unit regions. In the second unit regions, an optical axis of the light sources is coincident with a center of the first recess. In the first unit region, the optical axis of the light source is offset from the center of the first recess, and an upper surface of the light-transmitting member has a first receding part.

A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.

Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly LED chip structures with electrical overstress protection are disclosed. LED chip structures are disclosed that include built-in electrical overstress protection. An exemplary LED chip may include an active LED structure that is arranged as a primary light-emitting structure and a separate active LED structure that is arranged as an electrical overstress protection structure. The electrical overstress protection structure may be electrically connected in reverse relative to the primary light-emitting structure. In this manner, under normal operating conditions, forward current will flow through the primary light-emitting structure to generate desired light emissions, and during an electrical overstress event, reverse current may flow through the electrical overstress protection structure, thereby protecting the light-emitting structure from damage.

A method for manufacturing a display device related to a micro-light-emitting diode (micro-LED) according to an embodiment of the present disclosure comprises the steps of: moving an assembly device comprising a magnetic body, while the assembly device is in contact or not in contact with an assembly substrate (a chamber filled with fluid is positioned below the assembly device and the assembly substrate, wherein a plurality of specific semiconductor light-emitting diodes are included in the chamber); on the basis of a magnetic field generated by the assembly device, moving the plurality of specific semiconductor light-emitting diodes in the chamber in a direction in which the assembly substrate is positioned; arranging, in first-type assembly grooves in the assembly substrate, a first group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes; and arranging, in second-type assembly grooves in the assembly substrate, a second group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes.

A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a stepped portion, in which a diameter of the through hole is small on the side closer to the substrate and is large on the side far from the substrate.

Some embodiments of the disclosure provide an LED device, an LED lamp and a method for machining a conductive wire of an LED device. The Light-Emitting Diode (LED) device includes at least one LED chip, a bracket and at least one conductive wire. Each of the at least one conductive wire is of a three-dimensional structure and includes a vertical section, first stress cushioning section inclined obliquely upwards, second stress cushioning section inclined obliquely downwards and third stress cushioning section inclined obliquely downwards that are sequentially arranged. A first transition bending section, a second transition bending section and a third transition bending section are sequentially formed between the vertical section, the first stress cushioning section.

Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.

A heat dissipation structure of the door leaf of an LED display box, comprising a box frame (100) and a box door leaf (200), a heat collection cavity (300) is simultaneously formed in the box frame (100) and on the backs of the LED display modules, when working, a number of the LED display modules are energized and emitting light, and the light is irradiated forward, and the heat generated by the operation of the LED display modules is concentrated in the heat collection cavity (300), the box door leaf (200) comprises an outer door leaf plate (210) and an inner lining board (220), wherein the inner lining board (220) is arranged on the inner side (211) of the outer door leaf plate (210), and at the same time, a ventilation and heat dissipation channel (400) is formed between the inner lining board (220) and the outer door leaf plate (210), the ventilation and heat dissipation channel (400) is in communication with the heat collection cavity (300), the ventilation and heat dissipation channel (400) comprises an air inlet (410) and an air outlet (420), wherein the air inlet (410) is in communication with the heat collection cavity (300), and the air outlet (420) is arranged on the outer door leaf plate (210), the box heat source part (500) is fixedly connected to the inner side (221) of the lining board, and at the same time, the box heat source part (500) is located in the heat collection cavity (300).