The present disclosure discloses an LED bracket, including: a front bracket, wherein an LED lamp chip is provided in the front bracket; and a back bracket, wherein the back bracket is connected to the front bracket, and a diffusion material is provided on a side of the back bracket away from the front bracket, wherein the LED lamp chip can emit light from the front bracket and light emitted from a direction close to the back bracket passes through the diffusion material and then goes out from the back bracket. In the present disclosure, the front bracket is provided, the back bracket is additionally provided on the front bracket, the diffusion material is provided on the back bracket.

A light emitting assembly comprising a solid state device, when and if coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first wavelength radiation (i.e., primary radiation), and a set of nesting enclosures enhancing the luminescence of the solid-state device and providing a mechanism for arranging luminophoric medium in receiving relationship to said first radiation, and which in exposure to said first radiation, is excited to responsively emit a second wavelength radiation (i.e., secondary radiation) or to otherwise transfer its energy without radiation to a third radiative component (i.e., tertiary radiation). In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is converted to achromatic light with fluorescers and phosphors under an inert gas. In a specific embodiment, heat is dissipated to the external surroundings without employing a heat sink.

A light emitting device includes a light emitting element, a substrate, and a cap. The cap surrounds the light emitting element disposed on the substrate, and has a plurality of lateral portions including a first lateral portion having a first inner lateral surface through which the light emitted from a light emitting surface and traveling along an optical axis passes, and a second lateral portion having a second inner lateral surface different from the first inner lateral surface. The first inner lateral surface is inclined at a first inclination angle toward a side where the light emitting element is disposed with respect to a plane perpendicular to the mounting surface. The second inner lateral surface is inclined at a second inclination angle larger than the first inclination angle toward a side where the light emitting element is disposed with respect to a plane perpendicular to the mounting surface.

An electronic-element mounting package includes a wiring substrate having a first surface and a wiring pattern thereon; a base having a second surface and a through hole whose opening is on the second surface; a signal line penetrating the through hole and having a first end exposed from an opening of the through hole; and an insulating member between an inner surface of the through hole and the signal line and has an end portion and a main portion. The end portion has an end surface on a side of the opening of the through hole, and the main portion is farther from the opening of the through hole than the end portion. The electronic-element mounting package also has a conductive joining material with which the wiring pattern and the first end are joined. Permittivity of the end portion is larger than permittivity of the main portion.

The window material for an optical element of the present invention is formed of synthetic quartz glass that is likely to be subjected to shape processing, can be manufactured at low cost, and has a flat plate shape. Even if the window material for an optical element has a flat plate shape, for example, in a window material of a UV-LED such as a UVC-LED sealed with a surface mount package (SMD PKG), light emitted from the optical element, in particular, light having a light distribution angle can be efficiently collected when passing through the window material, and light collection equal to that of a window material having a lens shape such as a conventional convex shape can be achieved. Furthermore, light distribution without irradiation unevenness such as Lambertian reflection can also be achieved.

A lens includes a cover part and a light-shielding part. The cover part includes a lens part, a connection part, and a plurality of flange parts, formed with a thermosetting first resin and continuous to one another. The light-shielding part covers lateral end surfaces and an upper surface of each of the flange parts and outer lateral sides of the connection part and formed with a thermosetting second resin having a greater light-absorptance or a greater light-reflectance than the thermosetting first resin.

A light-emitting device includes a light-emitting element, a first lead, a second lead, and a mold resin member. The light-emitting element is mounted on the first lead. The second lead is electrically connected to the light-emitting element via a conductive member, and disposed away from the first lead along a first direction. The mold resin member directly or indirectly covers the light-emitting element. The mold resin member includes a lens portion located above the light-emitting element, a fixing portion configured to fix the first lead and the second lead, and an inclined portion. The inclined portion is located between the lens portion and the fixing portion, and the inclined portion has at least a portion spreading and inclined from a boundary between the inclined portion and the lens portion toward a boundary between the inclined portion and the fixing portion. The light-emitting element is disposed inside the fixing portion.

A light emitting device includes: a plurality of element structural bodies, each including: a substrate, a light emitting element mounted on or above the substrate, and a light-transmissive member disposed on or above the light emitting element, wherein at least three of the plurality of element structural bodies are disposed along a first direction; a first covering member that covers lateral surfaces of the substrate, the light emitting element, and the light-transmissive member of each of the plurality of element structural bodies; and a support member that covers a lateral surface of the first covering member, wherein at least a portion of the support member is disposed lateral to the plurality of element structural bodies and extends along the first direction. A rigidity of the support member is greater than a rigidity of the first covering member.

A light emitting apparatus includes: an electrically insulating base member having, in a top plan view, a first edge, a second edge opposite the first edge, a third edge, and a fourth edge opposite the third edge, wherein the first and second edges of the base member extend in a first direction, and the third and fourth edges of the base member extend in a second direction; first and second electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the first and second electrically conductive pattern portions; a transparent member disposed on the at least one light emitting device; and a resin portion that surrounds the transparent member in the top plan view, and that partially covers the first and second electrically conductive pattern portions.

A light-emitting diode package includes a transparent layer; a plurality of light-emitting diodes disposed on a surface of the transparent layer, wherein each of the plurality of light-emitting diodes comprise a light-emitting surface that faces the transparent layer; a spacer disposed on the surface of the transparent layer; a protection member configured to cover the plurality of light-emitting diodes; and a plurality of light-emitting diode electrode pads comprising an electrode pad on each of the plurality of light-emitting diodes; wherein a first height from the surface of the transparent layer to an upper end of the spacer is larger than a second height from the surface of the transparent layer to the plurality of light-emitting diode electrode pads.