A light-emitting device includes light-emitting elements each having a light-extracting surface, light-transmissive members and a covering member, The light-transmissive members each has an upper surface and a lower surface facing the light-extracting surface of at least one of the light-emitting elements. The covering member integrally covers lateral surfaces of the light-emitting elements and lateral surfaces of the light-transmissive members such that a pair of electrodes of the light-emitting elements are exposed from the covering member at a lower surface of the covering member. At a lower surface of the light-emitting device, the light-emitting elements are arranged in a plurality of columns and a plurality of rows, an alignment direction of the electrodes in one of the light-emitting elements is rotated by 90° in a prescribed. direction from an alignment direction of the electrodes in an adjacent one of the light-emitting elements in one of a column direction and a row direction.

A light-emitting device includes light-emitting elements each having a light-extracting surface, light-transmissive members and a covering member, The light-transmissive members each has an upper surface and a lower surface facing the light-extracting surface of at least one of the light-emitting elements. The covering member integrally covers lateral surfaces of the light-emitting elements and lateral surfaces of the light-transmissive members such that a pair of electrodes of the light-emitting elements are exposed from the covering member at a lower surface of the covering member. At a lower surface of the light-emitting device, the light-emitting elements are arranged in a plurality of columns and a plurality of rows, an alignment direction of the electrodes in one of the light-emitting elements is rotated by 90° in a prescribed. direction from an alignment direction of the electrodes in an adjacent one of the light-emitting elements in one of a column direction and a row direction.

A method of fabricating one or more optoelectronic devices each comprising at least one passive optical component. The method comprises providing a first carrier, depositing a soluble adhesive onto a surface of the first carrier, and placing a plurality of integrated circuit devices onto said surface and curing the soluble adhesive to fix the integrated circuit devices to the carrier. The method further comprises depositing a molding material onto a plurality of molds of a second carrier to form a plurality of said passive optical components, aligning said first and second carriers such that the plurality of passive optical components contact respective zones of the plurality of integrated circuit devices, injecting a polymer compound into a space between said first and second carriers and curing said polymer compound, removing said second carrier to leave the plurality of optical components fixed to the integrated circuit devices by said polymer compound, and dissolving said soluble adhesive to remove the integrated circuit devices, polymer compound and passive optical components from the first carrier to provide a wafer package.

An image display device includes: a circuit element; a first interconnect layer electrically connected to the circuit element; a first insulating film covering the circuit element and the first interconnect layer; a light emitting element disposed on the first insulating film; a second insulating film covering at least a part of the light emitting element; a second interconnect layer electrically connected to the light emitting element and disposed on the second insulating film; and a first via extending through the first insulating film and the second insulating film, and electrically connecting the first interconnect layer and the second interconnect layer.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

An electronic part includes: a chip part having a first main surface and a second main surface opposite to the first main surface, a wiring portion being derived from the chip part; and a substrate having a pad forming surface, pads to which the wiring portion can be connected being formed on the pad forming surface, in which a gap is formed between the second main surface and the pad forming surface while the wiring portion is connected to a predetermined pad of the pads.

An electronic part includes: a chip part having a first main surface and a second main surface opposite to the first main surface, a wiring portion being derived from the chip part; and a substrate having a pad forming surface, pads to which the wiring portion can be connected being formed on the pad forming surface, in which a gap is formed between the second main surface and the pad forming surface while the wiring portion is connected to a predetermined pad of the pads.

A touch display device includes a light-emitting component, a first insulating layer, a touch part, a first transmission part, a first conductive connection structure, a second transmission part and a bonding part. The light-emitting component is disposed within a display area. A first insulating layer is disposed above the light-emitting component and disposed within the display area and a peripheral area. The touch part is disposed above the first insulating layer and within the display area. The first transmission part is disposed within the peripheral area. The first transmission part is electrically connected to the touch part. The second transmission part is disposed below the first transmission part and within the peripheral area. The first transmission part is electrically connected to the second transmission part via the first conductive connection structure. The bonding part is electrically connected to the second transmission part.

A display apparatus including: a plurality of display modules, each including a substrate and inorganic light emitting diodes mounted on a mounting surface of the substrate; a cover layer configured to cover the mounting surface of each of the display modules; and an adhesive layer arranged between the cover layer and the mounting surface of each of the display modules to cause the cover layer to adhere to the mounting surface of each of the display modules, wherein the adhesive layer includes a first region, disposed on a gap formed between the plurality of display modules, and a second region disposed on the mounting surface of each of the display modules, and wherein the adhesive layer includes a photosensitive material such that the first region of the adhesive layer is configured to undergo a photosensitive reaction based on an external light source.