Provided is an upper substrate for a miniature LED component, a miniature LED component, and a miniature LED display device, wherein the upper substrate for the miniature LED component comprises: a bottom substrate; a metal layer formed on the bottom substrate and having a pattern capable of covering a non-opening region of the lower substrate for the miniature LED component; a graphene layer formed on the bottom substrate; a transparent adhesive layer formed on the bottom substrate to cover the metal layer and the graphene layer.

An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.

A header for a semiconductor package, includes an eyelet having a through hole penetrating the eyelet from an upper surface to a lower surface of the eyelet, a first lead inserted inside the through hole, and an insulating substrate disposed on the upper surface of the eyelet, and provided with a first through hole at a position overlapping one end of the first lead in a plan view. The insulating substrate has a thermal conductivity lower than a thermal conductivity of the first lead. A first conductive layer is formed on an inner wall defining the first through hole, and the first conductive layer extends to an upper surface of the insulating substrate. The one end of the first lead is electrically connected to the first conductive layer, and a space is provided above the one end of the first lead inside the first through hole.

A device for disinfecting surfaces is provided. One embodiment has a plurality of UV light (energy) emitting LEDs residing in an enclosure, wherein emitted UV energy passes through a lens onto a surface being disinfected; a heat dissipator that receives heat generated by the UV emitting LEDs; and a fluid moving device. The enclosure has a fluid heating passageway that is in fluid contact with the heat dissipator, has a transfer passageway with a distal end that is fluidly coupled to a proximal end of the fluid heating passageway, and has a return passageway that is fluidly coupled to a proximal end of the transfer passageway and that is fluidly coupled to a distal end of the fluid heating passageway. During operation, the fluid moving device operates to circulate a cooling fluid through the fluid heating passageway, the transfer passageway, and the return passageway. Heat transfers to the ambient environment.

A device for disinfecting surfaces is provided. One embodiment has a plurality of UV light (energy) emitting LEDs residing in an enclosure, wherein emitted UV energy passes through a lens onto a surface being disinfected; a heat dissipator that receives heat generated by the UV emitting LEDs; and a fluid moving device. The enclosure has a fluid heating passageway that is in fluid contact with the heat dissipator, has a transfer passageway with a distal end that is fluidly coupled to a proximal end of the fluid heating passageway, and has a return passageway that is fluidly coupled to a proximal end of the transfer passageway and that is fluidly coupled to a distal end of the fluid heating passageway. During operation, the fluid moving device operates to circulate a cooling fluid through the fluid heating passageway, the transfer passageway, and the return passageway. Heat transfers to the ambient environment.

A tiled display device includes a base part including a first substrate and a pad part, display devices disposed on the base part, each of the display devices including a second substrate and a display layer disposed on an upper surface of the second substrate, and a conductive adhesive part disposed between the base part and the display devices and electrically connecting the base part to the display devices.

A tiled display device includes a base part including a first substrate and a pad part, display devices disposed on the base part, each of the display devices including a second substrate and a display layer disposed on an upper surface of the second substrate, and a conductive adhesive part disposed between the base part and the display devices and electrically connecting the base part to the display devices.

A display device includes a display panel, a heat radiation metal plate arranged on a rear surface or a side surface of the display panel, a printed circuit board arranged on a rear surface of the heat radiation plate so as to be connected to the display panel, and a conductive tape configured to cover the heat radiation plate and the printed circuit board. The conductive tape conductively connects the rear surface of the heat radiation plate to a ground terminal of the printed circuit board.

A wavelength conversion member includes: a phosphor; a metal joining layer provided on a bottom surface and a side surface of the phosphor; a metal heat-dissipating holding unit including a recess that covers the bottom surface and at least a portion of the side surface of the phosphor and that accommodates the phosphor so that the phosphor is embedded in the recess; and a metal porous joining material provided between the metal joining layer and the metal heat-dissipating holding unit.

A cap is mounted to a support substrate, the cap including a cap body and an optical shutter. The cap and support substrate define a housing. An electronic chip is disposed in the housing above the support substrate. A face of the electronic chip supports an optical device that is optically coupled with the optical shutter. The cap body is thermally conductive. Within the housing, a thermally conductive linking structure is coupled in a thermally conductive manner between the cap body and the electronic chip. The thermally conductive linking structure surrounds the electronic chip. A thermal interface material fills a portion of the housing between the thermally conductive linking structure and the cap body.