In the present disclosure, a semiconductor structure includes an Mx-1 layer including a first dielectric layer and first metal features, wherein the first metal features include a first set of first metal features in a first region and a second set of first metal features in a second region, wherein the first set has a first pattern density and the second set has a second pattern density being greater than the first pattern density. The structure further includes a Vx layer disposed over the Mx-1 layer, the Vx layer including first vias contacting the first set of the first metal features. The structure further includes an Mx layer disposed over the Vx layer, the Mx layer including a fuse element, wherein the fuse element has a first thickness in the first region less than a second thickness in the second region.

The present disclosure describes methods of forming a colored conductive ribbon for a solar module which includes combining a conductive ribbon with a channeled ribbon holder, applying a color coating to at least the conductive ribbon within the channel, curing the color coating on the conductive ribbon, and separating the conductive ribbon from the channeled holder.

According to one embodiment, a wiring fabrication method includes pressing a first template including a first recessed portion and a second recessed portion provided at a bottom of the first recessed portion against a first film to form a first pattern including a first raised portion, corresponding to the first recessed portion, and a second raised portion, corresponding to the second recessed portion. The second raised portion protrudes from the first raised portion once formed. After forming the first pattern, a first wiring, corresponding to the first raised portion, and a via, corresponding to the second raised portion, is formed using the first pattern.

Representative implementations of techniques and devices are used to remedy or mitigate the effects of damaged interconnect pads of bonded substrates. A recess of predetermined size and shape is formed in the surface of a second substrate of the bonded substrates, at a location that is aligned with the damaged interconnect pad on the first substrate. The recess encloses the damage or surface variance of the pad, when the first and second substrates are bonded.

The present disclosure describes methods of forming a colored conductive ribbon for a solar module which includes combining a conductive ribbon with a channeled ribbon holder, applying a color coating to at least the conductive ribbon within the channel, curing the color coating on the conductive ribbon, and separating the conductive ribbon from the channeled holder.

In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.

The present disclosure describes methods of forming a colored conductive ribbon for a solar module which includes combining a conductive ribbon with a channeled ribbon holder, applying a color coating to at least the conductive ribbon within the channel, curing the color coating on the conductive ribbon, and separating the conductive ribbon from the channeled holder.

A film having a plurality of lighting devices thereon is transferred between a film supplying roll and a film collecting roll, and an organic light emitting layer and a second electrode are formed on the film being transferred from a deposition unit. An aging unit is provided on a rear end of the deposition unit, and applies an aging voltage to the film transferred after the organic light emitting layer is deposited by the deposition unit, thereby aging the organic light emitting layer.

In a described example, an apparatus includes: a semiconductor die having a device side surface; bond pads on the semiconductor die on the device side surface; post connects having a proximate end on the bond pads and extending from the bond pads to a distal end, the diameter of the post connects at the proximate end being the same as the diameter of the post connects at the distal end; polyimide material covering sides of the post connects and covering at least a portion of the bond pads; and solder bumps on the distal end of the post connects.

Representative implementations of techniques and devices are used to remedy or mitigate the effects of damaged interconnect pads of bonded substrates. A recess of predetermined size and shape is formed in the surface of a second substrate of the bonded substrates, at a location that is aligned with the damaged interconnect pad on the first substrate. The recess encloses the damage or surface variance of the pad, when the first and second substrates are bonded.