A method includes forming a dielectric layer on a substrate; forming a first spiral electrode, a second spiral electrode, and a spiral common electrode in the dielectric layer, the first spiral electrode extending in a first spiral path, the second spiral electrode extending in a second spiral path, and the spiral common electrode extending in a third spiral path laterally between the first and second spiral paths.

A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.

A capacitor includes a first spiral electrode and a second spiral electrode. The first spiral electrode is over a substrate. The second spiral electrode is over the substrate and is concentric with the first spiral electrode. A first turn of the second spiral electrode connecting to a spiral center of the second spiral electrode is free of a via thereon.

A package structure may include a one-piece metal carrier, a die, a mold layer and a redistribution layer. The one-piece metal carrier may include a bottom portion and a first supporting structure, and the one-piece metal carrier may have a recess defined by the bottom portion and the first supporting structure. The die may be disposed in the recess of the one-piece metal carrier, and the die may have a plurality of conductive bumps. The mold layer may be formed to encapsulate the die. The mold layer may expose a portion of each of the plurality of conductive bumps and a portion of the first supporting structure. The redistribution layer may be disposed on the mold layer and electrically connected to the plurality of conductive bumps.

A vapor deposition unit (1) includes: a vapor deposition mask (10); a limiting plate unit (20) having limiting plates (22); and a vapor deposition source (30). The vapor deposition source (30) includes: a plurality of first openings (31) for injection of vapor deposition particles; and at least one second opening (32) for pressure release, wherein each of the first openings (31) is provided in a corresponding one of limiting plate openings (23) between the limiting plates (22) in a plan view, and the at least one second opening (32) is provided in such a position as not to face the limiting plate openings (23) in a plan view.

A semiconductor device and a method of manufacturing the semiconductor device are provided. The semiconductor device comprises a first electrical conductor, a first additional electrical conductor, a first active region, a second electrical conductor, a second additional electrical conductor, and a second active region. The first electrical conductor has a first width and extends along a first direction. The first additional electrical conductor has a second width and extends along the first direction. The second width is greater than the first width. The first active region extends along a second direction perpendicular to the first direction. The first active region overlaps the first electrical conductor and the first additional electrical conductor from a top view perspective. The second electrical conductor has the first width and extends along the first direction. The second additional electrical conductor has the second width and extends along the first direction.

A film having a plurality of lighting devices thereon is transferred between a film supplying roll and a film collecting roll, and an organic light emitting layer and a second electrode are formed on the film being transferred from a deposition unit. An aging unit is provided on a rear end of the deposition unit, and applies an aging voltage to the film transferred after the organic light emitting layer is deposited by the deposition unit, thereby aging the organic light emitting layer.

A vapor deposition unit (1) includes: a vapor deposition mask (10); a limiting plate unit (20) having limiting plates (22); and a vapor deposition source (30). The vapor deposition source (30) includes: a plurality of first openings (31) for injection of vapor deposition particles; and at least one second opening (32) for pressure release, wherein each of the first openings (31) is provided in a corresponding one of limiting plate openings (23) between the limiting plates (22) in a plan view, and the at least one second opening (32) is provided in such a position as not to face the limiting plate openings (23) in a plan view.

A mobile target coating device includes: a target source; a target source carrier section configured to carry and drive the target source to move; an infrared temperature detecting section configured to detect a temperature of a surface of the target source; an infrared heating section configured to heat the target source; a control section configured to receive a detection signal of the infrared temperature detecting section and determine whether the temperature of the surface of the target source is uniform or not; the control section is further configured to control the infrared heating section to heat a portion having a lower temperature of the surface of the target source and to stop heating after the temperature of the surface of the target source becomes uniform. A coating method using a mobile target coating device is also disclosed.

A mobile target coating device includes: a target source; a target source carrier section configured to carry and drive the target source to move; an infrared temperature detecting section configured to detect a temperature of a surface of the target source; an infrared heating section configured to heat the target source; a control section configured to receive a detection signal of the infrared temperature detecting section and determine whether the temperature of the surface of the target source is uniform or not; the control section is further configured to control the infrared heating section to heat a portion having a lower temperature of the surface of the target source and to stop heating after the temperature of the surface of the target source becomes uniform. A coating method using a mobile target coating device is also disclosed.