Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

An image pickup apparatus includes an image pickup device including a wiring connecting a first electrode on a light receiving surface and a second electrode on a rear surface, a first wiring board including a distal end surface, from which a flying lead protrudes, arranged to oppose the rear surface of the image pickup device, a second wiring board including a second main surface to which an upper surface of the first wiring board is made to adhere and including a distal end surface arranged to oppose the rear surface, in which the flying lead is bent and bonded to the second electrode, and a sealing member sealing a bonding section between the second electrode and the flying lead and an adhesion member that makes the distal end surface of the second wiring board and the rear surface adhere to each other are composed of integral curable resin.

Deformation of a semiconductor chip is to be prevented in a semiconductor device in which a heat releasing plate and a circuit board are disposed. The semiconductor device includes the semiconductor chip, the circuit board, the heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

In a mounting structure in which an electronic component is mounted on a wiring board, a wiring sheet including an adhesive layer interposes between the electronic component and the wiring board and the electronic component is indirectly mounted on the wiring board. The electronic component is directly mounted on the adhesive layer of the wiring sheet and the adhesive layer of the wiring sheet is directly fitted to the wiring board. Conduction between the electronic component and the wiring board is attained by conduction between the electronic component and the wiring sheet and conduction between the wiring sheet and the wiring board.

A chip-on film and a display device including the same are disclosed. The chip-on film includes a first base film, a second base film positioned on the first base film, a film pad portion positioned on at least one side of the second base film and exposed to the outside of the first base film, and a coating layer positioned on one surface of the first base film.

An apparatus is provided which comprises: a first die having at least one bond pad; a first flexible layer comprising an anisotropic conductive material, wherein the first flexible layer is adjacent to the at least one bond pad such that it makes an electrical contact with the at least one bond pad; and a second flexible layer comprising a conductive metal, wherein the second flexible layer is adjacent to the first flexible layer.