A flip-chip bonding apparatus (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding apparatus heats the semiconductor die (70), bonds the protruding electrodes (73) of the semiconductor die (70) to protruding electrodes (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). Continuous vacuum suction holes (15) are provided in the base (11), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island (13).

A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).

A light-emitting diode (LED) transfer device is provided. The LED transfer device includes a transfer assembly configured to move a first substrate, on which a plurality of LEDs are provided, above a second substrate, a laser light source configured to emit a laser beam toward the first substrate, a mask that is disposed between the first substrate and the laser light source and has a plurality of openings that are configured to be selectively exposed and blocked and a processor configured to control the transfer assembly to move the first substrate to a predetermined position and selectively rotate the first substrate, and control the mask to expose and block the plurality of openings corresponding to the plurality of LEDs to be transferred from the first substrate to the second substrate.

A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.

A bonding apparatus having an optical system, an imaging element for acquiring an image formed by the optical system as a picture, an illumination unit for illuminating an electronic component, and a control part for processing the image acquired by the imaging element, the control part illuminating the electronic component through a first inclined optical path inclined with respect to the optical axis of a first portion of the optical system facing the electronic component and acquiring a first image, illuminating the electronic component through a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis and acquiring a second image of the electronic component as a subject, and calculating an amount of variation from a reference height of the electronic component on the basis of the positional offset amount between the first image and the second image.

A method of manufacturing a semiconductor device includes a step of preparing a semiconductor element including a functional surface on which a bump is formed and an adhesive layer of a film shape including a flux component, a step of positioning the semiconductor element above a board including an electrode, a step of activating a flux component by applying ultrasonic vibration to the semiconductor element, a step of bringing the bump into contact with the electrode by pressing the semiconductor element to the board, and a step of bonding the bump to the electrode by continuing the application of the ultrasonic vibration and the pressing of the semiconductor element.

A flip-chip bonding apparatus (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding apparatus heats the semiconductor die (70), bonds the protruding electrodes (73) of the semiconductor die (70) to protruding electrodes (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). Continuous vacuum suction holes (15) are provided in the base (11), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island (13).

According to one embodiment, a chip transfer member includes a light-transmitting portion and a metal portion. The light-transmitting portion has a light incident surface, a light-emitting surface, and a side surface. The metal portion is provided at the side surface of the light-transmitting portion.

A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.

A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a deposit point, at least partly about the third axis containing the deposit point, by means of a rotary drive and/or to be propelled in a controlled manner by means of at least one linear drive at least partly along one of the first, second or third axes, and/or to propel, in a controlled manner, a carrier guided by the reception device, along one of the first and/or second axes.