The present invention provides a chip mounting system and a method for mounting chips. The chip mounting system includes a first carrier device, a second carrier device, and a chip capturing device. The first carrier device includes a plurality of first carrier platforms for respectively carrying a plurality of semiconductor structures. Each semiconductor structure includes a base layer and a plurality of light emitting chips disposed on the base layer. The second carrier device includes a second carrier platform for carrying a circuit substrate. The chip capturing device is used for moving the light emitting chip from the base layer to the circuit substrate. The red, the green, and the blue light-emitting groups of the same sequence are disposed adjacent to each other, so that the red, the green, and the blue light-emitting chips of the same sequence are arranged adjacent to each other to form a pixel.

A pressurizing device includes: a mounting base; an upper mold which pressurizes the target object mounted on the mounting base from above; a heating lower mold which is a lower mold heated in advance by a heater, and which heats the target object under pressure by sandwiching the mounting base with the upper mold; a cooling lower mold which is a lower mold cooled in advance by a cooler, and which cools the target object under pressure by sandwiching the mounting base with the upper mold; and a control device which switches the lower mold that contributes to the pressurization of the target object to the heating lower mold or the cooling lower mold in accordance with the status of progress of the pressurization process for the target object.

A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head has a suction hole in a face that holds the semiconductor chip. The pressure reduction mechanism communicates with the suction hole and is configured to reduce pressure inside the suction hole. The resin sheet feed mechanism is configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip. An electrode that protrudes from a top face of the semiconductor chip is bonded by thermocompression after being embedded in the resin sheet.

A method of manufacturing a semiconductor device includes a step of preparing a semiconductor element including a functional surface on which a bump is formed and an adhesive layer of a film shape including a flux component, a step of positioning the semiconductor element above a board including an electrode, a step of activating a flux component by applying ultrasonic vibration to the semiconductor element, a step of bringing the bump into contact with the electrode by pressing the semiconductor element to the board, and a step of bonding the bump to the electrode by continuing the application of the ultrasonic vibration and the pressing of the semiconductor element.

Embodiments relate to forming an elastomeric interface layer (elayer) with a flap over multiple light emitting diode (LED) dies by forming materials across multiple LED dies and removing the materials between the LED dies. The formed flap of the elayer provides a large surface area for adhesion between each LED and a pick-up surface. For example, the flap may have a surface area that is larger than the light emitting surface of the LED die, or larger than the surface area of an elastomeric interface layer without the flap. As such, the elayer allows each LED to be picked up by a pick-up surface and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (?LED) dies.

The present invention provides a chip mounting system and a method for mounting chips. The chip mounting system includes a first carrier device, a second carrier device, and a chip capturing device. The first carrier device includes a plurality of first carrier platforms for respectively carrying a plurality of semiconductor structures. Each semiconductor structure includes a base layer and a plurality of light emitting chips disposed on the base layer. The second carrier device includes a second carrier platform for carrying a circuit substrate. The chip capturing device is used for moving the light emitting chip from the base layer to the circuit substrate. The red, the green, and the blue light-emitting groups of the same sequence are disposed adjacent to each other, so that the red, the green, and the blue light-emitting chips of the same sequence are arranged adjacent to each other to form a pixel.

An electric-programmable magnetic module comprising a micro electro mechanical system (MEMS) chip and a bonding equipment is provided. The MEMS chip comprises a plurality of electromagnetic coils and each of the electromagnetic coils is individually controlled. The MEMS chip is assembled with and carried by the bonding equipment.

A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a deposit point, at least partly about the third axis containing the deposit point, by means of a rotary drive and/or to be propelled in a controlled manner by means of at least one linear drive at least partly along one of the first, second or third axes, and/or to propel, in a controlled manner, a carrier guided by the reception device, along one of the first and/or second axes.

A component-handling device for removing components from a structured component supply and for storing the removed components at a reception device, where the reception device is newly adjusted after being initially put into operation after the replacement of device components or after maintenance work, in order to comply with the precision requirements when handling the components. The component-handling device has a self-adjustment device which permits it to adjust the device efficiently in terms of time and with high precision without manual intervention by an operator. The self-adjustment device is composed of a multiplicity of optical sensors and a controller. Adaptation of the measurement results acquired by means of the optical sensors using position sensors and property sensors installed originally for component inspection during fabrication gives rise to a high degree of process reliability and at the same time permits device components to be inspected for damage.

A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support substrate, providing a release layer over the micro-device or the pocket, optionally providing a base layer on a side of the release layer opposite the micro-device, disposing the micro-device in the pocket with the release layer between the micro-device and the support substrate so that no portion of the support substrate or the optional base layer is in contact with the micro-device, etching the release layer to completely separate the micro-device from the support substrate or the optional base layer, providing a stamp having a conformable stamp post and pressing the stamp post against the separated micro-device to adhere the micro-device to the stamp post, and removing the stamp and micro-device from the support substrate.