A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

A method of attaching one or more active devices on one or more substrates to a metal carrier by hot stamping is disclosed. The method includes contacting the active device(s) on the substrate(s) with the metal carrier, and applying pressure to and heating the active device(s) on the substrate(s) and the metal carrier sufficiently to affix or attach the active device(s) on the substrate(s) to the metal carrier. The active device(s) may include an integrated circuit. The substrate(s) may include a metal substrate on the backside of the active device and a protective/carrier film on the frontside of the active device. The protective/carrier film may be or include an organic polymer. The metal carrier may be or include a metal foil. Various examples of the method further include thinning the metal substrate, dicing the active device(s) and a continuous substrate, and/or separating the active devices.

A method of attaching one or more active devices on one or more substrates to a metal carrier by hot stamping is disclosed. The method includes contacting the active device(s) on the substrate(s) with the metal carrier, and applying pressure to and heating the active device(s) on the substrate(s) and the metal carrier sufficiently to affix or attach the active device(s) on the substrate(s) to the metal carrier. The active device(s) may include an integrated circuit. The substrate(s) may include a metal substrate on the backside of the active device and a protective/carrier film on the frontside of the active device. The protective/carrier film may be or include an organic polymer. The metal carrier may be or include a metal foil. Various examples of the method further include thinning the metal substrate, dicing the active device(s) and a continuous substrate, and/or separating the active devices.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.

A unit lead frame includes a periphery structure, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and trenches or grooves extending from an outer surface of the periphery structure and configured to guide liquefied molding material onto the periphery structure along sidewalls of the trenches or grooves.

A unit lead frame includes a periphery structure, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and trenches or grooves extending from an outer surface of the periphery structure and configured to guide liquefied molding material onto the periphery structure along sidewalls of the trenches or grooves.

A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.

A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.

A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.