A method for fabricating chip package includes providing a semiconductor chip with a metal bump, next adhering the semiconductor chip to a substrate using a glue material, next forming a polymer material on the substrate, on the semiconductor chip, and on the metal bump, next polishing the polymer material, next forming a patterned circuit layer over the polymer material and connected to the metal bump, and then forming a tin-containing ball over the patterned circuit layer and connected to the patterned circuit layer.

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

Highly reliable interconnections for microelectronic packaging. In one embodiment, dielectric layers in a build-up interconnect have a gradation in glass transition temperature; and the later applied dielectric layers are laminated at temperatures lower than the glass transition temperatures of the earlier applied dielectric layers. In one embodiment, the glass transition temperatures of earlier applied dielectric films in a build-up interconnect are increased through a thermosetting process to exceed the temperature for laminating the later applied dielectric films. In one embodiment, a polyimide material is formed with embedded catalysts to promote cross-linking after a film of the polyimide material is laminated (e.g., through photo-chemical or thermal degradation of the encapsulant of the catalysts). In one embodiment, the solder resist opening walls have a wettable layer generated through laser assisted seeding so that there is no gap between the solder resist opening walls and no underfill in the solder resist opening.

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.

A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.