Provided is a thermally conductive film-like adhesive capable of sufficiently advancing a curing reaction under milder conditions, capable of effectively suppressing residual voids between the adhesive and a wiring board in a semiconductor package to be obtained when used as a die attach film, and capable of obtaining a semiconductor package excellent in heat releasing property inside the package. In addition, provided are a semiconductor package using the thermally conductive film-like adhesive and a method of producing the same.

Embodiments of a thermal compression bonding process bond head and a method for producing a thermal compression bonding process bond head are disclosed. In some embodiments, the bond head includes a thermal compression bonding process heater and a cooling block coupled to the heater through an annular structure. The annular structure surrounds a lower portion of the cooling block and couples the cooling block to the heater such that there is no direct mechanical contact between the cooling block and the heater.

A chip package structure is provided. The chip package structure includes a first chip structure. The chip package structure includes a heat-spreading substrate over the first chip structure. The chip package structure includes a second chip structure over the heat-spreading substrate. The second chip structure is electrically connected to the first chip structure through the conductive plug structure, the first thermal conductivity of the substrate is higher than a third thermal conductivity of the second chip structure, and the heat-spreading substrate is in direct contact with the first chip structure and the second chip structure.