A semiconductor component includes a radiation exit surface; a semiconductor body having an active region that generates radiation; wherein a molded body molded onto the semiconductor body; contacts for external electrical contacting of the semiconductor component are accessible on an outer side of the molded body; a deflection structure arranged between the active region and the radiation exit surface; a planarization layer arranged on the deflection structure; and a polarizer arranged on a side of the planarization layer facing away from the semiconductor body; wherein the semiconductor body on a side facing away from the radiation exit surface includes a mirror structure having at least one dielectric layer and a metallic connection layer, and the dielectric layer is arranged at locations between the semiconductor body and the metallic connection layer.

A display device including: a plurality of electrodes including a first electrode on a substrate and extending in a first direction, a second electrode spaced from the first electrode in a second direction, a third electrode between the first electrode and the second electrode, and a fourth electrode spaced from the second electrode in the second direction, a first insulating layer on the plurality of electrodes, a plurality of light emitting elements on the plurality of electrodes that are spaced from each other in the second direction on the first insulating layer, a second insulating layer on the first insulating layer and the plurality of light emitting elements and including a plurality of openings, a plurality of connection electrodes on at least some of the plurality of electrodes, in contact with the plurality of light emitting elements, and spaced from each other in the first direction and the second direction.

The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.

An illumination apparatus comprises a plurality of LEDs aligned to an array of directional optical elements wherein the LEDs are substantially at the input aperture of respective optical elements. An electrode array is formed on the array of optical elements to provide at least a first electrical connection to the array of LED elements. Advantageously such an arrangement provides low cost and high efficiency from the directional LED array.

This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.

A semiconductor package substrate includes a semiconductor housing space including a mounting surface being provided on a bottom side and configured to mount a semiconductor light-emitting element, and a reflective wall being provided around the mounting surface and configured to reflect light emitted from the semiconductor light-emitting element to be mounted on the mounting surface; a mounting region being provided at a rim portion and configured to mount a lid member for covering the semiconductor light-emitting element; and a flow-suppressing portion separating the mounting region and the reflective wall spatially in such a manner that a joining member joining the lid member to the rim portion is suppressed from flowing from the mounting region into the semiconductor housing space.

Solid-state transducers (“SSTs”) and vertical high voltage SSTs having buried contacts are disclosed herein. An SST die in accordance with a particular embodiment can include a transducer structure having a first semiconductor material at a first side of the transducer structure, and a second semiconductor material at a second side of the transducer structure. The SST can further include a plurality of first contacts at the first side and electrically coupled to the first semiconductor material, and a plurality of second contacts extending from the first side to the second semiconductor material and electrically coupled to the second semiconductor material. An interconnect can be formed between at least one first contact and one second contact. The interconnects can be covered with a plurality of package materials.

This disclosure provides an LED chip packaging module includes: a re-distribution layer RDL, where a plurality of first pads are disposed on a lower surface of the RDL; a micro light emitting diode micro LED chip disposed on an upper surface of the RDL, where an electrode of the micro LED chip faces the upper surface of the RDL and is connected to the RDL; and a micro integrated circuit micro IC disposed on the upper surface of the RDL, where an electrode of the micro IC faces the upper surface of the RDL and is connected to the RDL. The first pad is electrically connected to the micro IC by using the RDL. The micro IC is electrically connected to the micro LED chip by using the RDL. The first pad is configured to receive an external drive signal.

A substrate for light emitting elements includes: a resin layer having a sheet shape, a first surface, and a second surface located opposite to the first surface. The second surface has one or more groove portions that includes a first groove portion. The second surface is divided by the first groove portion into a plurality of regions that include the first region and the second region. The resin layer includes a plurality of fiber bundles and a resin. The substrate includes a first electrically-conductive layer located in the first region of the resin layer; and a second electrically-conductive layer located in the second region of the resin layer. In a plan view, the at least one continuous fiber bundle extends inside the resin layer across the first region, a portion below the first groove portion, and the second region.

A die bonding method for a micro-LED. The method includes plating tin at a die bonding position of a printed circuit board (PCB) to obtain a tin-plated layer; adding a protective layer and a flux layer on the tin-plated layer in sequence to obtain a pretreated PCB; and transferring a flip-chip micro-LED to the pretreated PCB, reflowing and die bonding to complete die bonding of the micro-LED.