H01P1/045

Connecting unit for connecting to first and second interfaces, where the connecting unit comprises an internal conductor disposed within a housing formed by half-shell construction

A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.

Manufacturing method for non-magnetic water-cooled microwave ablation needle

The present invention relates to a method for manufacturing a nonmagnetic water-cooled microwave ablation needle. The manufacturing method is designed for a microwave ablation needle of a nonmagnetic material and has a proper process procedure, favorable assembly quality, and high production efficiency. The produced nonmagnetic water-cooled microwave ablation needle is applicable to microwave tumor ablation surgery in a nuclear magnetic resonance imaging environment, and helps a doctor in charge to clearly determine a position of a tumor, improve piercing precision, have preferable control on a whole surgery process, improve a success rate of the surgery, reduce damage on surrounding normal tissues as much as possible on the premise of effectively inactivating the tumor, alleviate pain of a patient, and shorten a recovery cycle.

METHODS AND APPARATUSES FOR REDUCING PASSIVE INTERMODULATION DISTORTION IN TRANSMISSION LINES

Methods and apparatuses for reducing passive intermodulation distortion arising from a joint attaching conductors by forming the joint with a single metal or covering the joint with a single layer of metal having a thickness greater than a skin depth of the frequency of signals propagating through the joint.

Millimeter Wave Impedance Matching Structures

An electronic device may be provided with a transceiver, a substrate, and antennas mounted to the substrate. The transceiver and antennas may convey signals between 10 GHz and 300 GHz. A radio-frequency connector may be mounted to the substrate. A coaxial cable may couple the transceiver to the connector. A stripline in the substrate may couple the connector to the antennas. Impedance matching structures may be embedded in the substrate for matching an impedance of the stripline to an impedance of the coaxial cable. The impedance matching structures may include a fence of conductive vias, landing pads, and a volume of the dielectric substrate defined by the fence of conductive vias and the landing pads. The impedance matching structures may be configured to perform impedance matching over a relatively wide bandwidth that includes the frequency band of operation for the antennas.

CAVITY FILTER
20200303797 · 2020-09-24 · ·

A cavity filter includes a cavity, a cover plate, a tuning component, and a resonant column. The cover plate is connected to the cavity, and the cover plate is configured to cover the cavity to form a resonant cavity. A through hole is provided on the cover plate, and the tuning component passes through the through hole and is fastened on the cover plate. The tuning part includes a high-conductivity part and a non-conductivity part, the high-conductivity part is located in the cavity, and the resonant column is in the cavity.

RF transition assembly comprising an open coaxial structure with a cavity for receiving a conductor that is coupled orthogonal to an RF transmission layer

An RF transition assembly (300) for enabling a radiofrequency transition between an RF transmission layer (301) of an electronic device and a conductor (309) which is electrically connected (317) to the RF transmission layer (301). The conductor (309) extends generally orthogonal to the RF transmission layer (301). The assembly comprises an open coaxial structure (313) located adjacent to an edge of the RF transmission layer (301). The open coaxial structure (313) comprises a cavity (315) extending therethrough for receiving the conductor (309). The cavity (315) comprises an opening facing the edge of the RF transmission layer (301) so as to direct electromagnetic radiation towards the RF transmission layer (301).

Terminal portion configured to connect an RF signal connector to an electrode pad of an external device over a predetermined distance
11876273 · 2024-01-16 · ·

The present disclosure relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: first side terminal contacted with the electrode pad; and the second side terminal connected to the RF signal connecting portion. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS
20200022277 · 2020-01-16 ·

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.

High frequency connection including first and second high frequency connectors connected by a two section dielectric coupling sleeve
10535910 · 2020-01-14 · ·

The present disclosure relates to a dielectric coupling sleeve configured to capacitively couple a first electrical conductor to a second electrical conductor. The dielectric coupling sleeve includes a first sleeve section and a second sleeve section. The first sleeve section has a first diameter. A receiving space is closed on one side and formed in the first sleeve section. The receiving section is configured to receive an insertion of the first electrical conductor. The second sleeve section has a second diameter. The second diameter is smaller than the first diameter. The second sleeve section is configured for insertion into the conductor cavity of the second electrical conductor.

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT AND ASSEMBLY MECHANISMS FOR AND BETWEEN CHIPS, COMPONENTS, AND 3D SYSTEMS

Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.