Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.

A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.

An optical module may include an optical subassembly having a receptacle. The receptacle may have a first diameter. The optical module may include a housing having a circular opening for receiving the receptacle. The circular opening may have a second diameter. The first diameter and the second diameter may be sized to reduce electromagnetic interference at a cut-off frequency from the optical module. The cut-off frequency may be defined by a data rate of at least one component of the optical module.

An optical module may include an optical subassembly having a receptacle. The receptacle may have a first diameter. The optical module may include a housing having a circular opening for receiving the receptacle. The circular opening may have a second diameter. The first diameter and the second diameter may be sized to reduce electromagnetic interference at a cut-off frequency from the optical module. The cut-off frequency may be defined by a data rate of at least one component of the optical module.

An electrical connector configured to electrically couple a signal transmission line to another signal transmission line is disclosed. The electrical connector comprises: a first electrical conductor disposed around a center axis, the first electrical conductor having a taper along its length, wherein the first electrical conductor is substantially azimuthally symmetric around the center axis; a second electrical conductor disposed around the center axis, the second electrical conductor having the taper along its length, the second electrical conductor being substantially azimuthally symmetric around the center axis; a dielectric region comprising a gas, and disposed between the first electrical conductor and the second electrical conductor, the dielectric region having the taper along its length; and a dielectric element disposed in the dielectric region between the first and second electrical conductors, the dielectric element being substantially azimuthally symmetric around the center axis.

An electrical connector configured to electrically couple a signal transmission line to another signal transmission line is disclosed. The electrical connector comprises: a first electrical conductor disposed around a center axis, the first electrical conductor having a taper along its length, wherein the first electrical conductor is substantially azimuthally symmetric around the center axis; a second electrical conductor disposed around the center axis, the second electrical conductor having the taper along its length, the second electrical conductor being substantially azimuthally symmetric around the center axis; a dielectric region comprising a gas, and disposed between the first electrical conductor and the second electrical conductor, the dielectric region having the taper along its length; and a dielectric element disposed in the dielectric region between the first and second electrical conductors, the dielectric element being substantially azimuthally symmetric around the center axis.

Systems and methods for isolating radio frequency (RF) signals in high frequency circuit assemblies, including but not limited to 5G communication systems, are provided. The circuit assemblies include an RF suppression structure, which can be in the form of a low ohm resistor, that extends across a transmission line, and that has contacts that are electrically joined to a ground plane. Alternatively or in addition, the circuit assemblies include a low ohm resistor that extends over a transition between a signal via and an end of a transmission line, and that has contacts that are electrically joined to a ground plane. A circuit assembly as disclosed herein can further include multiple low ohm resistors spaced apart from one another by a distance that is a fraction of a wavelength of a highest frequency signal carried by the transmission line.

Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.

Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.

The present invention provides a common-mode signal absorber, which comprises an impedance-matching network and a common-mode signal reflection circuit. A differential-mode signal is inputted into input ends of the impedance-matching network, and outputted from output ends of the common-mode signal reflection circuit. When a common-mode signal is inputted into the common-mode signal absorber, the common-mode signal reflection circuit is for reflecting the common-mode signal within a specific frequency band. Afterward, the reflection of the common-mode signal within the specific frequency band will be absorbed by an impedance element of the impedance-matching network. Thus, the common-mode signal within the specific frequency band may be absorbed by the impedance-matching network so as to avoid to interfere signals transmitted on a communication system.