An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.

This document describes techniques and systems for planar surface features for waveguides and antennas. Two structures are arranged with opposing planar surfaces fixed adjacent to a separation plane dividing a channel (e.g., a waveguide, a feed network) to provide an energy path for propagating electromagnetic energy. Part of the channel is formed between side walls of a recessed groove within one opposing surface; another channel part is formed by an arrangement of surface features spaced and shaped on the other opposing surface. At least two surface features are adjacent protrusions contoured to compliment the sidewalls of the recessed groove. An area on each opposing surface between the recessed groove and the adjacent protrusions is configured to form the energy path through the channel including to prevent energy leakage from the separation plane dividing the channel.

This document describes techniques and systems for planar surface features for achieving antenna coverage. A structure is configured to provide a feed network for propagating electromagnetic energy along an energy path formed under a planar surface. The planar surface includes a recessed cavity with walls surrounding a cavity floor embedded within the planar surface. The cavity floor is shaped to form radiating slot(s) open through the structure to the energy path under the planar surface. A ridge feature protrudes from the planar surface on either side of the recessed cavity with a ridge length that is parallel with the cavity walls and a ridge height set to prevent cross-interference near the radiating slot within the cavity floor, thereby narrowing coverage for the electromagnetic energy within the feed network.

An encapsulated integrated circuit package is provided that includes an integrated circuit (IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF signal having a selected frequency. Encapsulation material encapsulates the IC die. A photonic waveguide couples to the RF circuit and extends to an external surface of the encapsulated IC. The photonic waveguide may be formed by a photonic bandgap structure within the encapsulation material. A socket may be included with the encapsulated package that is coupled to an end of the photonic waveguide opposite the RF circuit.

A multifunctional electromagnetic structure is presently disclosed. Said structure is a true electromagnetic bandgap (EBG) material, with both surface and leaky waves suppressed from the whole structure along all lateral directions. It is also an antenna element, configured to radiate to the broadside direction. The structure has two metallization layers of concentric rings between a square-shaped radiating top metal layer and a bottom ground plane. The lower concentric ring is connected to the ground plane through a plurality of vias, while the patch of the top metal layer is fed with a probe. The EBG unit cells may be used as antenna elements in a phased array environment, where they eliminate scan blindness from the array structure along all scan directions.

An electromagnetic band-gap (EBG) structure includes an antenna substrate layer, first conductive regions, and second conductive regions. The antenna substrate includes a first planar surface and a second planar surface. The first conductive regions are located on the first planar surface of the antenna substrate and separated from adjacent first conductive regions by a first distance. The second conductive regions are located on the first planar surface of the antenna substrate and are separated from the first conductive regions by a second distance and wherein the second conductive regions at least partially surround the first conductive regions.

Radio-frequency devices that include metamaterial structures are provided. Inclusion of resonator sections in a structure enables the utilization of desirable line segment widths without sacrificing performance, and further enables a reduction in the amount of space or area taken up by such devices on a printed circuit board.

The invention relates to a three-dimensional LC electrical resonator device having a given resonant frequency of 100 gigahertz or more, comprising: a separating layer; a first track made of a conductor and comprising two overlapping portions; and a second track made of a conductor, the second track comprising two overlapping portions and an inductive loop connecting the two overlapping portions, the first track and the second track respectively being formed on either side of the separating layer, each overlapping portion of the first track being placed facing a respective overlapping portion of the second track so as to form two capacitors that are spatially spaced apart from each other.

An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.

An encapsulated integrated circuit package is provided that includes an integrated circuit (IC) die. A radio frequency (RF) circuit on the IC die is operable to send and/or receive an RF signal having a selected frequency. Encapsulation material encapsulates the IC die. A photonic waveguide couples to the RF circuit and extends to an external surface of the encapsulated IC. The photonic waveguide may be formed by a photonic bandgap structure within the encapsulation material. A socket may be included with the encapsulated package that is coupled to an end of the photonic waveguide opposite the RF circuit.