H01P1/2005

Electronic circuit
09929455 · 2018-03-27 · ·

An electronic circuit includes: a substrate having an electromagnetic band gap structure formed including a ground conductor and a first conductor that includes multiple conductor plates, the conductor plates being arranged on a first surface, and at least a portion of the ground conductor being arranged on a second surface; and a second conductor that is arranged at a distance from and rearward of the conductor plates in a view from the second surface of the substrate, is connected to the ground conductor, and is electromagnetically coupled to at least a portion of the conductor plates.

UP-DOWN ZIGZAG ADDITIVE SPIRAL ANTENNA
20180083350 · 2018-03-22 · ·

A spiral antenna apparatus, which may comprise an antenna element disposed in two spiral arms in a vertical zigzag pattern. The apparatus may comprise an electromagnetic band gap cavity comprising: a ground plane, one or more layers of conductive patches, at least one pillar extending between the ground plane and a top layer of the one or more layers, and low dielectric foam disposed to fill gaps between the ground plane and the one or more layers and to fill gaps between the one or more layers. The apparatus may comprise a corrugated radio frequency choke disposed within the electromagnetic band gap cavity. At least one of the antenna element, the balun element, the electromagnetic band gap cavity, and the radio frequency choke may be fabricated using additive manufacturing.

METAMATERIALS FOR SURFACES AND WAVEGUIDES

Complementary metamaterial elements provide an effective permittivity and/or permeability for surface structures and/or waveguide structures. The complementary metamaterial resonant elements may include Babinet complements of split ring resonator (SRR) and electric LC (ELC) metamaterial elements. In some approaches, the complementary metamaterial elements are embedded in the bounding surfaces of planar waveguides, e.g. to implement waveguide based gradient index lenses for beam steering/focusing devices, antenna array feed structures, etc.

MULTI-BAND PERIODIC STRUCTURE ASSEMBLIES FOR RADIO FREQUENCY DEVICES
20180062233 · 2018-03-01 ·

Periodic structure assemblies are provided. An example assembly includes: a dielectric layer having a top and a bottom; a first frequency selective layer disposed on the top of the dielectric layer, the first frequency selective layer having a plurality of electrically conductive elements arranged as a first periodic structure; and a second frequency selective layer disposed on the bottom of the dielectric layer, the second frequency selective layer having a plurality of electrically conductive elements arranged as a second periodic structure. Another periodic structure assembly includes: a substrate; and an array of periodic elements defined by a contiguous trace of conductive material supported by the substrate, each of the periodic elements exhibiting side walls, with each of the side walls having an inwardly extending protrusion.

SPLIT RESONATOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.

Heatpipe to help reduce radio frequency interference
12160216 · 2024-12-03 · ·

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

A MICROWAVE OR MILLIMETER WAVE RF PART REALIZED BY DIE-FORMING
20180026378 · 2018-01-25 · ·

A method and apparatus for producing an RF part of an antenna system is disclosed, as well as thereby producible RF parts. The RF part has at least one surface provided with a plurality of protruding elements. In particular, the RF part may be a gap waveguide. The protruding elements are monolithically formed and fixed on a conducting layer, and all protruding elements are connected electrically to each other at their bases via the conductive layer. The RF part is produced by providing a die having a plurality of recessions forming the negative of the protruding elements of the RF part. The die may be a multilayer die, having several layers, at least some having through-holes to form the recessions. A formable piece of material is arranged on the die, and pressure is applied, thereby compressing the formable piece of material to conform with the recessions of the die.

STRUCTURE AND WIRING SUBSTRATE
20180026322 · 2018-01-25 · ·

Provided is a structure including at least: a first conductor plane; a second conductor plane disposed so as to face the first conductor plane; a first transmission line that is formed in a layer different from the first conductor plane and the second conductor plane and is disposed so as to face the second conductor plane, one end of the first transmission line being an open end; a conductor via that connects another end of the first transmission line with the first conductor plane; a slit that is formed on the second conductor plane and stretches to both sides of the first transmission line from a starting point where the slit overlaps the first transmission line in a plan view. Thus, a structure that enables formation of a compact EBG structure is provided.

WAVE CONTROL MEDIUM, METAMATERIAL, ELECTROMAGNETIC WAVE CONTROL MEMBER, SENSOR, ELECTROMAGNETIC WAVE WAVEGUIDE, COMPUTATION ELEMENT, TRANSMITTING/RECEIVNG DEVICE, LIGHT-RECEIVING/EMITTING DEVICE, ENERGY ABSORPTION MATERIAL, BLACKBODY MATERIAL, EXTINCTION MATERIAL, ENERGY CONVERSION MATERIAL, ELECTRIC WAVE LENS, OPTICAL LENS, COLOR FILTER, FREQUENCY SELECTION FILTER, ELECTROMAGNETIC WAVE REFLECTION MATERIAL, BEAM PHASE CONTROL DEVICE, ELECTROSPINNING DEVICE, DEVICE FOR MANUFACTURING WAVE CONTROL
20250023219 · 2025-01-16 ·

Provided is a wave control medium capable of controlling waves while miniaturizing and expanding the bandwidth of metamaterials or the like. The wave control medium according to the present technique includes a three-dimensional structure that includes a combination of a plurality of microstructures. The present technique makes it possible to provide a wave control medium capable of controlling waves while miniaturizing and expanding the bandwidth of metamaterials or the like.

Waveguide filters

A filter for filtering an electromagnetic wave and a filter design method are provided. The filter comprises a cavity with a first plate and a second plate, the first and second plates are opposite to each other. The first plate comprises a number of elements distributed on the side of the first plate facing the cavity, wherein a location of each element on the first plate is defined in a coordinate system. The second plate comprises a number of elements distributed on the side of the second plate facing the cavity according to the locations of the elements on the first plate, wherein each element is distributed on the second plate with an offset with respect to a corresponding element on the first plate.