An electronic circuit includes at least two first conductors having line shapes which are arranged on a first plane of a substrate, a second conductor arranged on a second plane of the substrate, and a third conductor having a line shape, with at least part thereof being arranged on a third plane between the first plane and the second plane of the substrate. The open end of the third conductor is included in part of the third conductor which is arranged on the third plane, and the part is arranged to at least partly overlap one of at least the two first conductors and not to overlap the other first conductor when viewed from a direction perpendicular to the substrate.

An electromagnetic bandgap structure and an electronic device having the same are provided. The electromagnetic bandgap structure includes a first conductive element, a second conductive element and a planar inductive element. The planar inductive element is disposed between the first conductive element and the second conductive element. Furthermore, the planar inductive element is electrically connected to the first conductive element via a first conductive pillar, and it is electrically connected to the second conductive element via a second conductive pillar.

This invention enables Frequency Selective Surface (FSS) and Artificial Magnetic Conductor (AMC) which exhibits Electromagnetic Band Gap (EBG) in any of the substrate's layer from a small and thin systems and sub-systems in package to a large-format PCBs. The metamaterial substrate may be integrated with electronic circuit components or buried in PCBs for circuit designs capable of transmitting, receiving and reflecting electromagnetic energy, altering electromagnetic properties of natural circuit materials, enhancing electrical characteristics of electrical components (such as filters, antennas, baluns, power dividers, transmission lines, amplifiers, power regulators, and printed circuits elements) in systems and sub-systems circuit designs. The metamaterial substrate creates new electrical characteristics, properties and systems, sub-systems or component's specification not readily available with conventional circuit materials, substrates, and PCBs. The metamaterial substrate can be less than 70 m thick and buried into any PCB layer.

Disclosed is a single notch filter, comprising a dielectric layer, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged onto two opposite surfaces of the dielectric layer, the first metal layer comprises a metal microstrip patch, the second metal layer comprises a coplanar waveguide plate and a metal grounding plate, and a fractal defected ground body of the coplanar waveguide plate is coupled with the metal microstrip patch based on the dielectric layer. Other embodiments are described and claimed.

A microwave oven comprising a cavity in which a material can be placed for heating and a magnetron for generating a microwave. The microwave oven further comprises an electromagnetic element adapted to interact with microwaves into the cavity and a control unit that provides a control signal to the electromagnetic element for modifying an impedance of the electromagnetic element during time of heating.

A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.

A waveguide structure including a plurality of unit structures, each of which at least includes a first conductive plane and a second conductive plane, which are arranged to partially face with each other, a plurality of transmission lines with one ends being open ends, which are disposed in a plane, positioned opposite to the second conductive plane, in a layer different from the first conductive plane and the second conductive plane, and at least one conductive via, which electrically connect between the first conductive plane and other ends of the transmission lines.

A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

A waveguide structure or a printed-circuit board is formed using a plurality of unit structures which are repetitively aligned in a one-dimensional manner or in a two-dimensional manner. The unit structure includes first and second conductive planes which are disposed in parallel with each other, a transmission line having an open end which is formed in a layer different from the first and second conductive planes and positioned to face the second conductive plane, and a conductive via electrically connecting the transmission line to the first conductive plane.

An electronic device includes a substrate (101), a conductor plane (104) which is provided on an inner layer of the substrate (101), an electronic circuit (102) which is mounted on the substrate (101), a heat sink (103) which is mounted on an upper surface of the electronic circuit (102), includes a portion which does not overlap with the electronic circuit (102) when seen in a plan view, faces the conductor plane (104), and is configured of a conductive material, a conductor via (105) which is connected to the heat sink (103) on a surface of the heat sink (103) contacting the electronic circuit (102), and extends toward the conductor plane (104), and a stub (106) which is connected to the conductor via (105) and extends to face the conductor plane (104).