According to an embodiment, an electronic device includes a housing, metal patches, and a first metal member. The housing includes a bottom, a lid, and a side unit. The side unit is disposed to enclose a space between the bottom and the lid. A circuit substrate is disposed on a bottom surface of the bottom. The side unit is conductive and connected to a ground potential. The metal patches are disposed on a lid surface of the lid. The metal patches are arranged periodically in a first direction and a second direction. The second direction intersects the first direction. The metal patches are connected to the ground potential. The first metal member is disposed on the lid surface. The first metal member is connected to the ground potential. The first metal member includes a first portion. The first portion contacts a first surface of the side unit.

A Radio Frequency, “RF”, component and a method of making the same. The component comprises a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also comprises a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier comprises a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member comprises a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.

An electronic circuit includes plural individual electronic circuits arranged, in which each of the plural individual electronic circuits has a first conductor column that is connected to a ground of a first layer which is any one of plural conductor layers sequentially stacked in a separated state and extends in a stacking direction, a conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer which is any one of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor column that is connected to the conductor line, is not connected to the ground, and extends in the stacking direction, and each of a first individual electronic circuit and a second individual electronic circuit adjacent to each other among the plural individual electronic circuits has at least a pair of the second conductor columns, which are formed at adjacent positions without interposing any one of the conductor lines of the first individual electronic circuit and the second individual electronic circuit between the pair of the second conductor columns.

An antenna assembly for use in a tile architecture antenna system. The antenna assembly comprises: i) a first substrate layer having a first surface; ii) a first antenna disposed in an X-Y plane on the first surface of the first substrate layer; iii) a second substrate layer having a first surface, the second substrate layer displaced in the Z-direction with respect to the X-Y plane on the first surface of the first substrate layer; and iv) a first tuning balun disposed on the first surface of the second substrate layer and coupled to the first antenna by means of a first feed via. The antenna assembly further comprises a first transmission line disposed on the first surface of the second substrate layer. The first transmission line is coupled to the first antenna by means of a second feed via.

A microwave/millimeter device having a narrow gap between two parallel surfaces of conducting material by using a texture or multilayer structure on one of the surfaces is disclosed. The fields are mainly present inside the gap, and not in the texture or layer structure itself, so the losses are small. The microwave/millimeter wave device further includes one or more conducting elements, such as a metallized ridge or a groove in one of the two surfaces, or a metal strip located in a multilayer structure between the two surfaces. The waves propagate along the conducting elements. At least one of the surfaces is provided with means to prohibit the waves from propagating in other directions between them than along the ridge, groove or strip. At very high frequency, the gap waveguides and gap lines may be realized inside an IC package or inside the chip itself.

An apparatus includes a substrate containing a cavity and a dielectric structure covering at least a portion of the cavity. The cavity is hermetically sealed. The apparatus also may include a launch structure formed on the dielectric structure and outside the hermetically sealed cavity. The launch structure is configured to cause radio frequency (RF) energy flowing in a first direction to enter the hermetically sealed cavity through the dielectric structure in a direction orthogonal to the first direction.

Nanopillar-based THz metamaterials, such as split ring resonator (SRR) MMs, utilizing displacement current in the dielectric medium between nanopillars that significantly increases energy storage in the MMs, leading to enhanced Q-factor. A metallic nanopillar array is designed in the form of a single gap (C-shape) SRR. Vacuum or dielectric materials of different permittivities are filled between the nanopillars to form nanoscale dielectric gaps. In other embodiments, formation of patterned nanowires using anodic aluminum oxide (AAO) templates with porous structures of different heights resulting from an initial step difference made by etching the aluminum (Al) thin film with a photoresist developer prior to the anodization process are disclosed.

An electronic circuit includes plural individual electronic circuits arranged, in which each of the plural individual electronic circuits has a first conductor column that is connected to a ground of a first layer which is any one of plural conductor layers sequentially stacked in a separated state and extends in a stacking direction, a conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer which is any one of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor column that is connected to the conductor line, is not connected to the ground, and extends in the stacking direction, and each of a first individual electronic circuit and a second individual electronic circuit adjacent to each other among the plural individual electronic circuits has at least a pair of the second conductor columns, which are formed at adjacent positions without interposing any one of the conductor lines of the first individual electronic circuit and the second individual electronic circuit between the pair of the second conductor columns.

An electronic circuit includes a conductor column that is connected to a ground of a first layer which is any one of plural conductor layers stacked in a separated state and extends in a stacking direction, a first conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor line that extends in a band shape in any layer of the plural conductor layers, in which each of the first conductor line and the second conductor line has one neighboring portion constituting at least a pair of neighboring portions, which are close to each other to be connectable, and a first end portion of the second conductor line, which is separated from the neighboring portion formed on the second conductor line, is an open end.

According to an aspect, there is provided a method of operating a first radio access node in a communication network, the method comprising determining whether a first base key that is used to determine a first encryption key for encrypting communications between a communication device and the first radio access node can be used by a second radio access node for determining a second encryption key for encrypting communications between the communication device and the second radio access node; and if the first base key can be used by the second radio access node, sending the first base key to the second radio access node during handover of the communication device from the first radio access node to the second radio access node.