An apparatus comprising: a sampler for over-sampling an input signal to produce a sampled input signal; a delta-sigma modulator for modulating the sampled input signal to produce a modulated signal; and a filter for filtering the modulated signal, the filter comprising: a conductive patch and a ground plane separated by a dielectric wherein the ground plane comprises a band-gap periodic structure.

An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

An electronic circuit includes a conductor column that is connected to a ground of a first layer which is any one of plural conductor layers stacked in a separated state and extends in a stacking direction, a first conductor line that is connected to the conductor column to extend in a band shape in a second layer different from the first layer of the plural conductor layers, and of which an end portion separated from the conductor column is an open end, and a second conductor line that extends in a band shape in any layer of the plural conductor layers, in which each of the first conductor line and the second conductor line has one neighboring portion constituting at least a pair of neighboring portions, which are close to each other to be connectable, and a first end portion of the second conductor line, which is separated from the neighboring portion formed on the second conductor line, is an open end.

In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedded interconnect is not limited to straight lines and can take a variety of shapes and paths in the dielectric material allowing for the electrical interconnect to have a longer length than the thickness of the dielectric material. Increasing the length of the electrical interconnect increases the inductance of the electrical interconnect which in turn increases the bandwidth and reduces the frequency of the electrical structure without an increase in the height of the dielectric material.

An electromagnetic band-gap (EBG) structure includes an antenna substrate layer, first conductive regions, and second conductive regions. The antenna substrate includes a first planar surface and a second planar surface. The first conductive regions are located on the first planar surface of the antenna substrate and separated from adjacent first conductive regions by a first distance. The second conductive regions are located on the first planar surface of the antenna substrate and are separated from the first conductive regions by a second distance and wherein the second conductive regions at least partially surround the first conductive regions.

A terahertz (THz) waveguide and method for production allows for THz waveguides to be used in or on a printed circuit board (PCB) such that the propagation of THz waves require less power, result in less signal loss due to radiation or dispersion, and propagate more efficiently. Additionally, the position and/or geometry of a waveguide, as well as any additional antenna or coupling element, may be adjusted on or in the PCB such that the electromagnetic field of the waveguide may more efficiently couple with the electromagnetic field of the PCB.

Terahertz device A1 includes first resin layer 21, columnar conductor 31, wiring layer 32, terahertz element 11, second resin layer 22, and external electrode 40. Resin layer 21 includes first resin layer obverse face 211 and first resin layer reverse face 212. Columnar conductor 31 includes first conductor obverse face 311 and first conductor reverse face 312, penetrating first resin layer 21 in z-direction. Wiring layer 32 spans between first resin layer obverse face 221 and first conductor obverse face 311. Terahertz element 11 includes element obverse face 111 and element reverse face 112, and converts between terahertz wave and electric energy. Second resin layer 22 includes second resin layer obverse face 221 and second resin layer reverse face 222, and covers wiring layer 32 and terahertz element 11. External electrode 40, disposed offset in a direction first resin layer reverse face 222 faces with respect to first resin layer 32, is electrically connected to columnar conductor 31. Terahertz element 11 is conductively bonded to wiring layer 32.

The present disclosure relates to a filter for filtering wavelengths of an electromagnetic signal to provide a filtered signal. The filter includes: at least one commensurate-line structure (CLS); and, at least one stub-modified commensurate-line structure (SMCLS) arranged to provide a corresponding at least one transmission zero in the filtered signal.

An electromagnetic band-gap (EBG) structure includes an antenna substrate layer, first conductive regions, and second conductive regions. The antenna substrate includes a first planar surface and a second planar surface. The first conductive regions are located on the first planar surface of the antenna substrate and separated from adjacent first conductive regions by a first distance. The second conductive regions are located on the first planar surface of the antenna substrate and are separated from the first conductive regions by a second distance and wherein the second conductive regions at least partially surround the first conductive regions.

According to an aspect, there is provided a method of operating a first radio access node in a communication network, the method comprising determining (601) whether a first base key that is used to determine a first encryption key for encrypting communications between a communication device and the first radio access node can be used by a second radio access node for determining a second encryption key for encrypting communications between the communication device and the second radio access node; and if the first base key can be used by the second radio access node, sending (603) the first base key to the second radio access node during handover of the communication device from the first radio access node to the second radio access node.