A printed circuit board transmission line utilized as a millimeter wave attenuator is provided. The printed circuit board transmission line includes a transmission line and a signal feed part. The transmission line has a first terminal and a second terminal. The signal feed part is electrically connected to the first terminal. The transmission line has a predetermined line width and a predetermined line length. The signal feed part receives an external signal, and the external signal is outputted from the second terminal through the transmission line. According to a degree of signal loss required in a practical application, the signal loss of the transmission line can be between 3 decibels and 40 decibels through a cooperation of the predetermined line width and the predetermined line length. Further, when the transmission line is utilized as a millimeter wave termination, the signal loss of the transmission line is 20 decibels.

Disclosed is a system and method for a 24-GHz phased array for indoor smart radar comprising at least 6 horizontally placed antenna elements as a vertically placed 5-element series-fed microstrip patch array. The beam of the phased array can be continuously steered on the H-plane to different directions through a novel vector control array. Each element can adjust the phase and amplitude of the corresponding element of the horizontally placed linear array. The phased array system of the present invention may be fabricated on a single printed circuit board (PCB), and PIN diodes are used to realize beam steering by modulating the decomposed received signal. In order to compensate for the loss of the vector control array and reduce the noise figure, six low noise amplifiers (LNAs) are also used in the array. The present invention has the ability to continuously steer the beam on the H-plane.

The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.

A resistive flex microwave attenuator for coupling control signals to a quantum computational hardware system includes a set of planar transmission lines, each such planar transmission line having first and second ends along a longitudinal axis. Each such planar transmission line includes: a set of ground planes disposed in a direction parallel to the longitudinal axis; a dielectric disposed in a direction parallel to the longitudinal axis and in contact with the set of ground planes; a signal line disposed in a direction parallel to the longitudinal axis and in contact with the set of ground planes; a metallic layer disposed around the set of ground planes; an input, coupled to such planar transmission line at the first end, and configured to receive the control signals; and an output, coupled to such planar transmission line at the second end, and configured for coupling to the quantum computational hardware system. At least one member selected from the group consisting of a ground plane of the set of ground planes and the signal line is resistive to provide attenuation. The set of planar transmission lines has a geometry configured for dissipation of heat, attributable to energy provided at the input, in a manner distributed along a length of the set of planar transmission lines. The set of planar transmission lines provide attenuation, without recourse to discrete components, across a desired frequency band. If there are a plurality of planar transmission lines, the set of planar transmission lines is disposed so that their respective ground planes are approximately coincident.

Systems and methods for operating a communication device. The methods comprise: obtaining a signal; allowing the signal to pass through a junction of a communication path to which a reflective frequency selective limiter is coupled; attenuating unwanted components of the signal using the reflective frequency selective limiter; and reflecting remaining components of the signal by the reflective frequency selective limiter so that the remaining components travel downstream along the communication path.

Systems and techniques that facilitate high-density embedded broadside-coupled attenuators are provided. In various embodiments, an attenuator can comprise an output line. In various aspects, the attenuator can further comprise a reflectively-terminated input line that is broadside coupled to the output line. In various instances, a downstream end of the reflectively-terminated input line can be shorted to ground. In other instances, a downstream end of the reflectively-terminated input line can be open from ground. In various cases, the output line can exhibit a non-looped-back-layout.

A resistive component in a hybrid microwave attenuator circuit is configured to attenuate a plurality of frequencies in an input signal. The hybrid microwave attenuator circuit is further configured with a dispersive component to attenuate a second plurality of frequencies within a frequency range by reflecting off portions of the input signal at those frequencies that are within the frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another in the hybrid microwave attenuator circuit.

Methods and apparatus for a frequency selective limiter (FSL) having a magnetic material substrate that tapers in thickness and supports a transmission line that has segments and bends. The segments, which differ in width and are substantially parallel to each other, such that each segment traverses the substrate on a constant thickness of the substrate.

The present disclosure provides a signal conditioner, an antenna device and a manufacturing method. The signal conditioner includes: a microstrip line including a first portion and a second portion; an insulating layer including a first insulating layer covering the first portion; at least one electrode; a liquid crystal layer covering the microstrip line, the insulating layer, and the at least one electrode; and a common electrode line. A first end of the first portion is connected to a first end of the second portion. A second end of the first portion is connected to a second end of the second portion. The at least one electrode includes a first electrode on a side of the first insulating layer facing away from the first portion. The common electrode line is on a side of the liquid crystal layer facing away from the microstrip line.

Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.