The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as Long-Term Evolution (LTE). The present disclosure provides a device for variable signal attenuation equipped in a stack-up structure inside an RFIC. The device for signal attenuation comprises: a first transmission line positioned on a first layer inside the RFIC; a second transmission line positioned on a second layer, which is adjacent to the first layer, and electromagnetically coupled to the first transmission line; and a control unit. The first transmission line comprises an impedance control unit on one side. The control unit can variably control the impedance control unit.

High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.

A frequency selective limiter (FSL) is provided having a transmission line structure with a tapered width. The FSL includes a substrate having a magnetic material, a signal (or center) conductor disposed on the substrate and first and second ground plane conductors disposed on the substrate. The signal conductor having a first end with a first width and a second end with a second different width such that the signal conductor is provided having a taper between the first and second ends of the signal conductor. First and second ground plane conductors are spaced apart from first and second edges of signal conductor, respectively, by a distance that changes from the first end of signal conductor to the second end of signal conductor such that signal conductor, and first and second ground plane conductors form a co-planar waveguide transmission line.

The technology described herein is directed towards a cryogenic-stripline microwave attenuator. A first high thermal conductivity substrate such as sapphire and a second high thermal conductivity substrate such as sapphire, along with a signal conductor comprising one or more attenuator lines between the substrates form a stripline. A compression component such as one or more screws, vias (plus clamps) and/or clamps presses the first high thermal conductivity substrate against one side of the signal conductor and presses the second high thermal conductivity substrate against another side of the signal conductor. The high thermal conductivity of the substrates facilitates improved thermalization, while the pressing of the substrates against the conductor reduces the thermal boundary (Kapitza) resistance and thereby, for example, improves thermalization and reduces thermal noise.

A differential signal transmitting circuit board includes a substrate, at least two differential conductive elements, and at least one insulating element. The differential conductive elements are disposed in the substrate. The insulating element is disposed in the substrate. The insulating element is close to or contacted to the differential conductive elements. A material of the substrate has a first equivalent dielectric constant. A material of the insulating element has a second equivalent dielectric constant. The first equivalent dielectric constant is different from the second equivalent dielectric constant.

A transmission line. The transmission line includes a reference electrode. The transmission line also includes a stripline. The stripline meanders within a plane. The stripline has a non-planar profile when viewed along a direction parallel to the plane.

Techniques related to microwave attenuator son high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more thin film lines, on a top surface of the substrate, comprising an evaporated alloy. Further, the device can comprise one or more vias within the substrate. Respective first ends of the one or more vias are can be connected to respective thin film connectors. Further, respective second ends of the one or more vias can be connected to an electrical ground.

Techniques for facilitating reduced thermal resistance attenuator on high-thermal conductivity substrates for quantum applications are provided. A device can comprise a substrate that provides a thermal conductivity level that is more than a defined thermal conductivity level. The device can also comprise one or more grooved transmission lines formed in the substrate. The one or more grooved transmission lines can comprise a powder substance. Further, the device can comprise one or more copper heat sinks formed in the substrate. The one or more copper heat sinks can provide a ground connection. Further, the one or more copper heat sinks can be formed adjacent to the one or more grooved transmission lines.

High-frequency thin film chip attenuators can include a substrate having a first side and a second side, a first portion coupled to the first side of the substrate, and a second portion coupled to the second side of the substrate. The first portion can include a ground section, an input contact section, and an output contact section. The second portion can include a ground section, an input section, an output section, and a plurality of resistive sections providing electrical communication between the input section, the output section, and the ground section. The resistive sections can be arranged in an attenuation configuration to attenuate a signal received at the input section and output via the output section. A plurality of through-holes extending through the substrate can provide electrical communication between sections on the first side of the substrate and associated sections on the second side of the substrate.

Disclosed is a system and method for a 24-GHz phased array for indoor smart radar comprising at least 6 horizontally placed antenna elements as a vertically placed 5-element series-fed microstrip patch array. The beam of the phased array can be continuously steered on the H-plane to different directions through a novel vector control array. Each element can adjust the phase and amplitude of the corresponding element of the horizontally placed linear array. The phased array system of the present invention may be fabricated on a single printed circuit board (PCB), and PIN diodes are used to realize beam steering by modulating the decomposed received signal. In order to compensate for the loss of the vector control array and reduce the noise figure, six low noise amplifiers (LNAs) are also used in the array. The present invention has the ability to continuously steer the beam on the H-plane.