A high power isolator having coolant channel structure includes a ferrite which is installed inside a junction of a waveguide; a permanent magnet which is installed in an outer groove of an upper part of the ferrite; and a water-cooled cooling device having a spiral-shaped water channel structure which is installed on the upper part of the permanent magnet; wherein the ferrite, the permanent magnet, and the water-cooled cooling device are formed in a symmetrical pair up and down.

In a wireless communication apparatus including a communication coupler and a circuit, a first substrate and a second substrate face each other in a longitudinal direction of the communication coupler. The first substrate includes a first signal line, a second signal line, a third signal line, a distributor, and a terminating resistor. At the distributor, the first signal line branches into the second signal line and the third signal line. The second signal line is terminated at the terminating resistor at an end of the first substrate. The second substrate includes a fourth signal line. At least one of the third signal line or the connection signal line is configured such that a phase of a signal at the facing portion of the second signal line and a phase of a signal at the facing portion of the fourth signal line are continuous.

In a wireless communication apparatus including a communication coupler and a circuit, a first substrate and a second substrate face each other in a longitudinal direction of the communication coupler. The first substrate includes a first signal line, a second signal line, a third signal line, a distributor, and a terminating resistor. At the distributor, the first signal line branches into the second signal line and the third signal line. The second signal line is terminated at the terminating resistor at an end of the first substrate. The second substrate includes a fourth signal line. At least one of the third signal line or the connection signal line is configured such that a phase of a signal at the facing portion of the second signal line and a phase of a signal at the facing portion of the fourth signal line are continuous.

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.

A tunable power absorbing termination for a waveguide transmission line includes a section of waveguide having a front power feed end, a back power extracting end, and guidewalls extending between the front and back end thereof. A coolant circulating dielectric taper extends into the section of waveguide in an inclined orientation relative to a guidewall of the section of waveguide such that the point end of the taper extends substantially to the front power feed end of the waveguide section. The inclined orientation of the dielectric taper creates a free volume of space adjacent the taper behind the front power feed end of the waveguide section into which a tuner element is introduced which is position adjustable within the free volume of space to provide the power absorbing termination with a tuning capability.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

Disclosed are various embodiments for a pre-matched power resistance system including a pre-matching network for use with a passive electrical device, such as a Lange coupler or a Wilkinson power splitter, where the system provides a predetermined input impedance across a predetermined target bandwidth. The pre-matched power resistance system network further includes an on-chip thin film resistor disposed on a substrate comprising a plurality of coplanar sub-resistors electrically isolated from one another and a manifold portion comprising a plurality of manifold traces in a tiered arrangement terminating in an electrical connection to a respective one of the coplanar sub-resistors.

Disclosed are various embodiments for a pre-matched power resistance system including a pre-matching network for use with a passive electrical device, such as a Lange coupler or a Wilkinson power splitter, where the system provides a predetermined input impedance across a predetermined target bandwidth. The pre-matched power resistance system network further includes an on-chip thin film resistor disposed on a substrate comprising a plurality of coplanar sub-resistors electrically isolated from one another and a manifold portion comprising a plurality of manifold traces in a tiered arrangement terminating in an electrical connection to a respective one of the coplanar sub-resistors.

A combiner-divider includes a first impedance converter disposed between the first port and the second port, a second impedance converter disposed between the first port and the third port, and an isolation unit disposed between the second port and the third port. The isolation unit includes a balun formed of a first semi-rigid cable and a second semi-rigid cable, and terminating resistors. Each line length of the first impedance converter, the second impedance converter, and the third impedance converter corresponds to ¼ wavelength at a center frequency. A relationship of each impedance Ri of the second port and the third port, an impedance Ro of the first port, and each impedance W of the first impedance converter and the second impedance converters is expressed by W=(2×Ri×Ro).sup.1/2.