H01P1/26

Combiner-divider

A combiner-divider includes a first impedance converter disposed between the first port and the second port, a second impedance converter disposed between the first port and the third port, and an isolation unit disposed between the second port and the third port. The isolation unit includes a balun formed of a first semi-rigid cable and a second semi-rigid cable, and terminating resistors. Each line length of the first impedance converter, the second impedance converter, and the third impedance converter corresponds to ¼ wavelength at a center frequency. A relationship of each impedance Ri of the second port and the third port, an impedance Ro of the first port, and each impedance W of the first impedance converter and the second impedance converters is expressed by W=(2×Ri×Ro).sup.1/2.

Waveguide non-reflective terminator and waveguide circuit

A waveguide unit (2) is closed at one end thereof by a short circuit plane (2a) provided with through holes (3-1 to 3-6). Radio wave absorbers (4-1 to 4-6) absorb a frequency signal being a non-reflective target in the state of being inserted through the through holes (3-1 to 3-6) toward the inside of the waveguide unit (2) and contacting inner surfaces (3′-1 to 3′-6) of the through holes (3-1 to 3-6).

Terminal device

Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.

SYSTEM AND METHOD FOR ATTENUATING AND/OR TERMINATING RF CIRCUIT
20210223285 · 2021-07-22 ·

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

METHOD AND APPARATUS FOR PROTECTING ELECTRICAL COMPONENTS FROM A TRANSIENT ELECTROMAGNETIC DISTURBANCE TRANSMITTED ON PARALLEL POWER LINES
20210305670 · 2021-09-30 ·

A device for preventing a signal induced by hazardous EMI on a power line in a group of multiple adjacent, parallel power lines of the same phase in an electrical power system from reaching an electrical component connected to one of the multiple power lines, the device comprising at least one conductive impedance transition element having a disk-shaped structure with multiple holes for receiving the multiple adjacent power lines of the same phase, the disk-shaped structures each having an outer diameter that is greater than diameter of all of the multiple parallel power lines to deliberately create an impedance mismatch between the conductive impedance transition elements and adjacent portions of the multiple power lines. The impedance mismatch causes the conductive impedance transition elements to reflect high-frequency components of a signal induced on the multiple power lines by hazardous EMI and the high-frequency components are reflected and dissipated as heat.

Hollow waveguide termination device

Hollow waveguide termination device utilizing a housing and a cup shaped inner attenuation element arranged therein and made of a material which absorbs electromagnetic oscillations. The attenuation element has a tubular section and a front wall section closing the tubular section on one side.

Energy absorbing circuit
11038282 · 2021-06-15 · ·

An energy absorbing circuit includes a power divider that is configured to divide an incoming RF signal into a plurality of RF component signals; a plurality of transmission lines that are connected with the power divider, each of the transmission lines configured to transmit a respective RF component signal of the plurality of RF component signals; and a plurality of matching elements, each matching element being terminated to a respective one of the transmission lines.

Surface mount assembled waveguide transition
11047951 · 2021-06-29 · ·

The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes a coupling port, wherein the coupling port is configured to couple at least one waveguide of the system to a component external to the waveguide.

Surface mount assembled waveguide transition
11047951 · 2021-06-29 · ·

The present application discloses embodiments that relate to a radar system. The embodiments may include a plurality of radiating waveguides each having a waveguide input. The embodiments also include an attenuation component, which can be located on a circuit board. The embodiments further include a beamforming network. The beamforming network includes a beamforming network input. The beamforming network also includes a plurality of beamforming network outputs, where each beamforming network output is coupled to one of the waveguide inputs. Additionally, the beamforming network includes a coupling port, wherein the coupling port is configured to couple at least one waveguide of the system to a component external to the waveguide.

TopSide Heatsinking Antenna Launcher for an Integrated Circuit Package

A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.