A method of forming a composite material for use as an isolator or circulator in a radiofrequency device comprises providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure, inserting a high dielectric constant inner material having a dielectric constant above 30 within an aperture in the low temperature fireable outer material, and co-firing the lower temperature fireable outer material and the high dielectric constant inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric constant inner material to form an integrated magnetic/dielectric assembly without the use of adhesive or glue.

A method of forming a composite material for use as an isolator or circulator in a radiofrequency device comprises providing a low temperature fireable outer material, the low fireable outer material having a garnet or scheelite structure, inserting a high dielectric constant inner material having a dielectric constant above 30 within an aperture in the low temperature fireable outer material, and co-firing the lower temperature fireable outer material and the high dielectric constant inner material together at temperature between 650-900° C. to shrink the low temperature fireable outer material around an outer surface of the high dielectric constant inner material to form an integrated magnetic/dielectric assembly without the use of adhesive or glue.

RF co-designed bandpass filters/isolators (BPFIs) are based on series-cascaded non-reciprocal resonant stages, microwave resonators and multi-resonant cells. The non-reciprocal stages are shaped by an in-parallel cascaded transistor-based path and a transmission line (TL) that result in a zero-phase resonance in the forward direction and high isolation in the reversed one. This includes coupling routing diagrams (CRDs) of BPFs that result in low- and high-order transfer functions with and without transmission zeros in their forward direction and high levels of isolation in the reverse one. BPFIs provide alternative-type of filtering responses (e.g., flat-passband, quasi-elliptic) with and without gain in the forward direction and high levels of isolation in the reversed one. BPFIs include five planar microstrip/lumped element (LE) prototypes using hybrid combinations of non-reciprocal resonant stages, microwave resonators and multi-resonant cells.

RF co-designed bandpass filters/isolators (BPFIs) are based on series-cascaded non-reciprocal resonant stages, microwave resonators and multi-resonant cells. The non-reciprocal stages are shaped by an in-parallel cascaded transistor-based path and a transmission line (TL) that result in a zero-phase resonance in the forward direction and high isolation in the reversed one. This includes coupling routing diagrams (CRDs) of BPFs that result in low- and high-order transfer functions with and without transmission zeros in their forward direction and high levels of isolation in the reverse one. BPFIs provide alternative-type of filtering responses (e.g., flat-passband, quasi-elliptic) with and without gain in the forward direction and high levels of isolation in the reversed one. BPFIs include five planar microstrip/lumped element (LE) prototypes using hybrid combinations of non-reciprocal resonant stages, microwave resonators and multi-resonant cells.

Disclosed herein is a non-reciprocal circuit element that includes a dielectric substrate having upper and lower surfaces, a magnetic rotator mounted on the dielectric substrate, and a permanent magnet that applies a magnetic field to the magnetic rotator. The dielectric substrate has a connection pattern formed on the upper surface thereof and connected to the magnetic rotator, a terminal electrode formed on the lower surface thereof and connected to the connection pattern, and a capacitor pattern formed on the upper surface, lower surface or inside the dielectric substrate.

Disclosed herein is a non-reciprocal circuit element that includes a dielectric substrate having upper and lower surfaces, a magnetic rotator mounted on the dielectric substrate, and a permanent magnet that applies a magnetic field to the magnetic rotator. The dielectric substrate has a connection pattern formed on the upper surface thereof and connected to the magnetic rotator, a terminal electrode formed on the lower surface thereof and connected to the connection pattern, and a capacitor pattern formed on the upper surface, lower surface or inside the dielectric substrate.

A high power isolator having coolant channel structure includes a ferrite which is installed inside a junction of a waveguide; a permanent magnet which is installed in an outer groove of an upper part of the ferrite; and a water-cooled cooling device having a spiral-shaped water channel structure which is installed on the upper part of the permanent magnet; wherein the ferrite, the permanent magnet, and the water-cooled cooling device are formed in a symmetrical pair up and down.

A high power isolator having coolant channel structure includes a ferrite which is installed inside a junction of a waveguide; a permanent magnet which is installed in an outer groove of an upper part of the ferrite; and a water-cooled cooling device having a spiral-shaped water channel structure which is installed on the upper part of the permanent magnet; wherein the ferrite, the permanent magnet, and the water-cooled cooling device are formed in a symmetrical pair up and down.

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.

Disclosed are embodiments of microstrip and substrate integrated waveguide circulators/isolators which can be integrated with a substrate. This composite structure can serve as a platform for other components, allowing for improved miniaturization of components. Embodiments of the disclosure can be particular advantageous in the high frequency ranges, such as above 1.8 GHz or above 3 GHz, which allows devices to be used in the 5G space.