A broadband waveguide comprising at least one filament configured to transmit a signal therethrough. The broadband waveguide may include one or more reflection suppression techniques including a damping material coupled to at least a portion of the at least one filament and/or at least one reflection point configured thereon. The waveguide may further including a cladding material coupled to the at least one filament. The at least one filament may be coupled to a securing element configured to couple to a surface. The at least one filament may be coupled to a sensor configured to sense the transmitted signal.

A broadband waveguide comprising at least one filament configured to transmit a signal therethrough. The broadband waveguide may include one or more reflection suppression techniques including a damping material coupled to at least a portion of the at least one filament and/or at least one reflection point configured thereon. The waveguide may further including a cladding material coupled to the at least one filament. The at least one filament may be coupled to a securing element configured to couple to a surface. The at least one filament may be coupled to a sensor configured to sense the transmitted signal.

A circuit board transmission line structures has microstrip or stripline transmission line geometries and cross-hatch patterned return planes. The cross-hatch design structure of the return planes and the relative position of the cross-hatch pattern to the transmission lines are configured to increase the usable bandwidth of the transmission lines. By properly adjusting the size and shape of the cross-hatch pattern, the performance of the microstrip and stripline transmission lines can be largely restored to the performance where continuous, solid return planes are used.

A circuit board transmission line structures has microstrip or stripline transmission line geometries and cross-hatch patterned return planes. The cross-hatch design structure of the return planes and the relative position of the cross-hatch pattern to the transmission lines are configured to increase the usable bandwidth of the transmission lines. By properly adjusting the size and shape of the cross-hatch pattern, the performance of the microstrip and stripline transmission lines can be largely restored to the performance where continuous, solid return planes are used.

A broadband waveguide comprising at least one filament configured to transmit a signal therethrough. The broadband waveguide may include one or more reflection suppression techniques including a damping material coupled to at least a portion of the at least one filament and/or at least one reflection point configured thereon. The waveguide may further including a cladding material coupled to the at least one filament. The at least one filament may be coupled to a securing element configured to couple to a surface. The at least one filament may be coupled to a sensor configured to sense the transmitted signal.

A broadband waveguide comprising at least one filament configured to transmit a signal therethrough. The broadband waveguide may include one or more reflection suppression techniques including a damping material coupled to at least a portion of the at least one filament and/or at least one reflection point configured thereon. The waveguide may further including a cladding material coupled to the at least one filament. The at least one filament may be coupled to a securing element configured to couple to a surface. The at least one filament may be coupled to a sensor configured to sense the transmitted signal.

A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

An interconnect topology that includes vertical trench routing in a substrate is disclosed. In one embodiment, the interconnect comprises a substrate having a plurality of layers including a first ground plane layer; a pair of signal conductors that form a differential signal pair, each conductor of the pair of signal conductors having a first portion and a second portion, the second portion extending from the first portion into at least one of the plurality of layers, wherein width of the second portion is less than width of the first portion; and wherein the first ground plane layer is only a first partial layer and has a first void region that is closer to the pair of signal conductors than the first partial layer.

A transmission line includes a substrate, a high-frequency signal transmission line, a differential signal transmission line, and a power supply line. The substrate is insulating, extends in a predetermined direction, and internally includes each of the high-frequency signal transmission line, the differential signal transmission line, and the power supply line. The power supply line and the high-frequency signal transmission line are in parallel or substantially in parallel to each other, and the differential signal transmission line is between the power supply line and the high-frequency signal transmission line.