A device, including: a dielectric case or chassis; a first integrated circuit (IC) configured to produce a millimeter wave signal; a first IC antenna configured to receive the millimeter wave signal from the IC and radiate the millimeter wave signal; and a first waveguide configured to guide the radiated millimeter wave signal to the dielectric case, wherein the millimeter wave signal is coupled into to the dielectric case.

A transition structure disposed in a package is disclosed. The transition structure comprises a first ground lead and a second ground lead; and a signal lead, disposed between the first ground lead and the second ground lead, wherein the first ground lead and the second ground lead have an exterior edge and an interior edge, the signal lead is coupled to a metal line formed on a printed circuit board (PCB) and a signal terminal of the die within the package; wherein an exterior gap formed between the first ground lead and the second ground lead at the exterior edge is wider than an interior gap formed between the first ground lead and the second ground lead at the interior edge.

Aspects of the subject disclosure may include, a system that can be configured for generating an electromagnetic wave and coupling the electromagnetic wave to a transmission medium with a reduced loss of radiation of the electromagnetic wave into free space. The system can also be configured to receive an electromagnetic waves form the transmission medium with a reduced loss of radiation of the electromagnetic wave into free space. Other embodiments are disclosed.

To provide a multilayer substrate for transmitting/receiving a high frequency signal, the substrate having a simplified configuration and excellent high frequency characteristics. This disclosure pertains to a multilayer substrate provided with: a plurality of dielectric layers laminated together with ground layers interposed therebetween; and a signal line for inputting and outputting a signal, the signal line being formed on the surface of the dielectric layer. The plurality of ground layers include an input-side ground layer part formed in the region on the signal-input side of the signal line, an output-side ground layer part formed in the region on the signal-output side of the signal line, and an intermediate ground layer part formed in the region between the input-side ground layer part and the output-side ground layer part. The input-side ground layer part and the output-side ground layer part each have fewer layers than the intermediate ground layer part.

This invention provides a high-frequency line adopting a structure to suppress an impedance variation and occurrence of an excessive power loss in high-frequency wiring having intersection with an optical waveguide. A high-frequency line is a microstrip line which has a basic configuration of stacking a ground electrode, a dielectric layer, and a signal electrode in this order on a SI-InP substrate. In addition, as shown in a transverse sectional view, an optical waveguide core made of InP-based semiconductor intersects with the high-frequency line in a crossing manner. A width of the signal electrode is partially increased in a certain region covering the intersection with the optical waveguide along a propagating direction of the high-frequency line. In the microstrip line, the width of the signal electrode is partially increased from w.sub.1 to w.sub.2, and characteristic impedance is thus reduced as compared to one with the uniform width w.sub.1.

A waveguide assembly which includes an elongated waveguide element (1) and a connector body (2). The connector body (2) is connected to an end of the elongated waveguide element (1) and has a substantially planar bottom surface (24) and an opposing top surface (23). The connector body is made from a single piece of partially metallized dielectric. The connector body has a waveguide coupling element (21) adjacent to the elongated waveguide element (1). The connector body further has an arrangement of electromagnetic band gap elements (27) adjacent to the waveguide coupling element (21).

Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

The present disclosure relates to a multilayer electromagnetic waveguide that includes a plurality of layers forming guide channels for an electromagnetic wave, and at least one transition device including at least one dielectric layer between two guide channels, referred to as coupled guide channels, extending as an extension. Each transition device includes at least one adaptation channel extending in a longitudinal direction, and each adaptation channel is defined by two electrically conductive walls. At least one wall extends along the dielectric spacer layer from one end of the coupled guide channel, over a length suitable for optimizing the transmission of an electromagnetic wave between the two coupled guide channels.

The present disclosure provides systems and methods associated with mode conversion for electromagnetic field modification. A mode converting structure (holographic metamaterial) is formed with a distribution of dielectric constants chosen to convert an electromagnetic radiation pattern from a first mode to a second mode to attain a target electromagnetic radiation pattern that is different from the input electromagnetic radiation pattern. A solution to a holographic equation provides a sufficiently accurate approximation of a distribution of dielectric constants that can be used to form a mode converting device for use with one or more transmission lines, such as waveguides. One or more optimization algorithms can be used to improve the efficiency of the mode conversion.

An overmoded dielectric-lined waveguide, particularly for the 0.03 to 3 terahertz frequency range, is disclosed with performance advantages relative to prior dielectric-lined waveguides, cost and size advantages relative to corrugated waveguides, and with coupling, bandwidth, and cost advantages relative to micro-structured-fiber waveguides. The waveguide comprises a single-clad flexible microwave laminate rolled into a cylinder with said copper surface on an outside of said guide tube and said dielectric surface on an inside of said guide tube. The rolled laminate is supported inside a metal tube. The same method of achieving the structure needed for efficient guiding of HE.sub.11 mode may be applied to a conical tube to make a low-cost efficient overmoded tapered waveguide transition for the 0.03-3 THz range.