A surface wave excitation device includes a transmission line disposed on a wire layer PCB, and a same quantity of layers are respectively disposed above and below the wire layer PCB. A copper wire is disposed on each layer of PCB, and the copper wire forms a closed region. Closed regions on the PCB that are respectively disposed above and below the wire layer PCB and that have a same distance from the wire layer PCB are in a same shape, and a closed region on a PCB farther away from the wire layer PCB occupies a larger area. The wire layer PCB includes first and second closed regions, the first closed region is disposed on one side of the transmission line, and the second closed region is disposed on the other side, and shapes of the first and second closed regions are mutually symmetrical with the transmission line as a symmetry axis.

Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a microstrip line positioned within the substrate assembly, where the waveguide antenna element overlaps the microstrip line. The apparatus may include a first conductive plane positioned on the first side of the substrate assembly. The apparatus may further include a second conductive plane positioned on the second side of the substrate assembly. The first conductive plane and the second conductive plane may define at least a portion of a planar surface integrated waveguide or a planar stripline.

An integrated circuit package includes a transmission line structure, conductive bonds, a post and a dielectric post. The transmission line structure runs from a printed circuit board (PCB) to an integrated circuit (IC) and includes a center transmission line surrounded by ground and sealed from exposure to air. The conductive bonds connect the transmission line structure to pads on the integrated circuit from where the center transmission line exits the integrated circuit package. The first post is part of the center transmission line where the center transmission line enters the integrated circuit package from the printed circuit board. The dielectric post supports the center transmission line where the center transmission line exits the integrated circuit package to connect to the conductive bonds and compensates part of the conductive bond inductance.

A radar level measurement device for level measurement or for determining a topology of a filling material surface in a container is provided, including a first radar chip and a second radar chip, the first radar chip including a first synchronisation circuit configured to generate a radio-frequency signal, and the second radar chip including a second synchronisation circuit; and a radio-frequency line assembly configured to transmit the radio-frequency signal from the first synchronisation circuit to the second synchronisation circuit to synchronise the first and the second radar chips, the radio-frequency line assembly including two or more different line types arranged in series with one another.

A high-frequency line connection structure 1 for connecting a coaxial line and a planar line includes a conductive second adhesion layer that is formed along edges of a pair of first conductive thin films of the planar line. Furthermore, end portions of the pair of first conductive thin films and an end portion of a second conductive thin film that is adjacent to the coaxial line are disposed to coincide with a position of an inner wall of a columnar penetrating hole formed in an outer conductor.

A rotary joint according to an aspect of the present disclosure includes a first microstrip line, a second microstrip line, a transmitting circuit connected to one end of the first microstrip line and configured to output a communication signal, a transmitting-side terminator connected to the other end of the first microstrip line, a receiving-side terminator connected to one end of the second microstrip line, and a receiving circuit connected to the other end of the second microstrip line and configured to receive the communication signal, in which the first and second microstrip lines and are set along at least a part of a circular ring having a circumferential length equal to an integral multiple of a wavelength of a traveling wave with which the communication signal propagates through the microstrip lines.

A glazing panel comprising (i) a pane of glass, (ii) an antenna, (iii) an electrically conductive connector joined to the antenna by a solder material, and (iv) a coaxial cable joined to the electrically conductive connector. The electrically conductive connector is a flat connector comprising first and a second electrically conductive portions laminated between two films of a resilient material.

The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

The present invention relates to a cavity filter including: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein a part of the terminal portion, positioned between the electrode pad and the RF signal connecting portion, is elastically deformed to absorb assembly tolerance existing in a terminal insertion port. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.