The present disclosure relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: first side terminal contacted with the electrode pad; and the second side terminal connected to the RF signal connecting portion. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

A connecting unit for radio-frequency components has: a housing; a first interface and a second interface which are arranged on the housing and are designed to be coupled to in each case one radio-frequency component; an internal conductor which runs in the housing and is connected to the first interface and the second interface in order to establish a radio-frequency connection between the first interface and the second interface; a spacer which surrounds the internal conductor and extends at least along a portion of the length of the internal conductor. The housing is manufactured from an electrically conductive and rigid material and the spacer is arranged such that the internal conductor is at a distance from the housing at least in sections.

An apparatus may include a substrate assembly having a first side and a second side. The apparatus may further include a waveguide antenna element positioned on the first side of the substrate assembly. The apparatus may also include a microstrip line positioned within the substrate assembly, where the waveguide antenna element overlaps the microstrip line. The apparatus may include a first conductive plane positioned on the first side of the substrate assembly. The apparatus may further include a second conductive plane positioned on the second side of the substrate assembly. The first conductive plane and the second conductive plane may define at least a portion of a planar surface integrated waveguide or a planar stripline.

Antenna systems have an RF connector, a PCB dipole antenna, and a radome. The RF connector provides a direct connection to the PCB and limits PIM. An omni-directional WiFi antenna has a pair of horizontal dipole antennas on a PCB having different wavelengths and same frequency. An omni-directional UMTS dual antenna has a vertical arrangement of two independent antennas on a PCB and has a jumper printed circuit board connecting the RF connector to the upper antenna. Corresponding connectors, radomes, and ways of combining antenna elements on a single PCB are also disclosed. A single frequency omnidirectional antenna includes both half and full wavelength dipole elements. A plus-shaped radome enhances the omnidirectional radiation pattern of the enclosed antenna. A jumper printed circuit board allows independent antennas on a single circuit board without the degradation of internal coaxial connections. The connector provides a direct interface with a circuit board to reduce the number of parts and also reduce passive intermodulation.

An adiabatic coaxial cable connector includes a chassis, and a planar transmission line within the chassis and having first and second ends. The coaxial cable connector further includes a first coaxial-to-planar transition within the chassis and connected to the first end of the planar transmission line, and a second coaxial-to-planar transition within the chassis and connected to the second end of the planar transmission line.

A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through the second polyimide film to make electrical and thermal contact with the first center conductor.

A chip comprising a bonding pad region and a transmission section. The bonding pad region has a first impedance, and is configured for electrical connection to an external transmission line. The transmission section extends away from the bonding pad region and has a second impedance. The bonding pad region is configured to enable field confinement and field matching between the bonding pad region and the external transmission line, and the second impedance is not equal to the first impedance.

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.

An apparatus includes a radio frequency (RF) translational joint. The RF translational joint includes a first coaxial line. The RF translational joint includes a first constant impedance coaxial transition connected to the first initial coaxial line. The RF translational joint includes a coax-to-stripline transition. The RF translational joint includes a stripline section connected to the first constant impedance coaxial transition via the coax-to-stripline transition. The RF translational joint includes a stripline-to-coax transition. The RF translational joint includes a second constant impedance coaxial transition connected to the stripline section via the stripline-to-coax transition. The RF translation joint includes a second coaxial line connected to the second constant impedance coaxial transition.

A waveguide fed planar antenna array with enhanced circular polarization (WFAECP) is disclosed. The WFAECP includes a plurality of dielectric layers forming a dielectric structure, an inner conductor formed within the dielectric structure, a first patch antenna element (PAE), a second PAE, a bottom and top conductor, a conductive via in signal communication with the bottom and top conductor, a first and second antenna slot within the first PAE and second PAE, and a waveguide. The dielectric layers includes top and bottom dielectric layers, where the top dielectric layer includes a top surface and the bottom dielectric layer includes a bottom surface. The first PAE is formed on the top surface of the top dielectric layer and the second PAE is formed on the bottom surface of the bottom dielectric layer. The waveguide includes a waveguide wall, backend, and cavity. The second PAE is located within the waveguide cavity.