Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

According to various embodiments, heat can be dissipated from a heat producing component mounted on a first side of a printed circuit board through a securing post extending out of the first side of the printed circuit board. The securing post can be configured to attach to a heat sink through a fastening mechanism. Subsequently, the securing post can transfer heat received from the heat producing component to the heat sink as part of dissipating the heat from the heat product component. The securing post can receive heat from the heat producing component through a printed circuit board heat transfer path integrated as part of the printed circuit board. The heat transfer path can include one or more thermal vias and one or more thermally conductive layers used to transfer the heat from the heat producing component to the securing post.

The present invention is a tunable bandpass filter to provide a constant absolute bandwidth across a tuning range, comprising of a pair of resonators to determine a filter center frequency, each said resonator has a rectangular waveguide cavity, wherein said filter center frequency depends on the dimensions of said rectangular waveguide cavity; a pair of side walls attached to said pair of resonators to form a filter housing; a tuning element movably attached to at least one of said pair of side walls and extending in said filter housing and movable orthogonally to said pair of resonators, and wherein said dimensions of said rectangular waveguide cavity change by moving said tuning element, thereby said filter center frequency is changed.

Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.

A composite resonator includes a first resonator extending in a first plane direction, a second resonator spaced apart from the first resonator in a first direction and extending in the first plane direction, a third resonator located between the first resonator and the second resonator in the first direction and configured to magnetically or capacitively connect to or electrically connect to each of the first resonator and the second resonator, and a reference conductor extending in the first plane direction, located between the first resonator and the second resonator in the first direction, and serving as a potential reference of the first resonator and the second resonator. The reference conductor surrounds at least a part of the third resonator in the first plane direction.

A resonating structure and a dielectric filter having the same are disclosed. The resonating structure comprises a body, at least one set of negative coupling holes, and a conductive material layer. The body is made of a solid dielectric material and comprises at least two resonators. The negative coupling holes are formed at a connection between two adjacent resonators. Each set of negative coupling holes comprises a first blind hole and a second blind hole disposed on two opposite surfaces of the body respectively. The first blind hole and the second blind hole are offset from each other in a plane perpendicular to a direction along which the first or second blind hole is dug. The conductive material layer covers surfaces of the body and surfaces of the first blind hole and the second blind hole.

The present invention relates to a cavity filter. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion is divided into a first side terminal contacted with the electrode pad and a second side terminal connected to the RF signal connecting portion, absorbs the assembly tolerance existing in a terminal insertion port, in which the terminal portion is provided, through an elastic member provided between the first side terminal and the second side terminal, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

Apparatus, and corresponding method, relates generally to a microelectronic device. In such an apparatus, a first conductive layer is for providing a lower interior surface of a circuit structure. A plurality of wire bond wires are interconnected to the lower interior surface and spaced apart from one another for providing at least one side of the circuit structure. A second conductive layer is for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires. The plurality of wire bond wires, the first conductive layer and the second conductive layer in combination define at least one opening in the at least one side for a signal port of the circuit structure. Such circuit structure may be a signal guide circuit structure, such as for a signal waveguide or signal cavity for example.

Disclosed herein are printed circuit boards (PCBs) with patterned ground structure filters and data storage devices comprising such PCBs. Each PCB comprises a resonator having an L-shape or a zig-zag shape in a plane of the printed circuit board and at least one signal trace. The resonator has a first dimension and a second dimension in the plane of the printed circuit board. A portion of the at least one signal trace is situated over the resonator and is separated by a distance from the resonator by a dielectric material. In some embodiments, at least part of the portion of the at least one signal trace extends in a same direction as the first dimension (in the case of an L-shaped resonator) or tracks the zig-zag shape of the resonator (in the case of a zig-zag-shaped resonator).

This disclosure relates to chips, and methods for manufacturing devices, that interact with electromagnetic radiation. A method for manufacturing a device comprises disposing an unpatterned graphene layer on a substrate, which comprises an unpatterned metal layer to form an unpatterned graphene-metal bi-layer attached to a surface of the substrate. The method then comprises patterning the bi-layer through the graphene layer and the metal layer with a design that comprises one or more superimposed trenches. Each of the one or more trenches extend through the graphene layer and the metal layer to provide interaction with electromagnetic radiation.