Patent classifications
H01P7/082
Bandpass filter
This invention reduces, in a type of bandpass filter that is called a strip-line filter or a microstrip filter, a variation in filter characteristics that can occur in a case where the design of the first line and the second line is changed. The bandpass filter (filter 10) includes a ground conductor layer, n resonators (141 to 146), and first and second lines (lines 151, 152), wherein the first and second lines (lines 151, 152) are respectively connected to a third side (side R13) of a first resonator (resonator 141) and a seventh side (side R63) of an n-th resonator, a gap (G1) is provided in an area of a fourth side (side R14) which area is close to a second resonator (resonator 142), and a gap (G6) is provided in an area of an eighth side (side R64) which area is close to an n−1-th resonator (resonator 145).
Bandpass filter
Deterioration is reduced in filter characteristics in a type of bandpass filter that is called a strip-line filter or a microstrip filter. A bandpass filter (filter 10) includes a ground conductor layer (12), a plurality of resonators (141 to 146) arranged in a layer spaced from the ground conductor layer (12), a first line (line 151) connected to a first-pole resonator (141) and a second line (line 152) connected to a last-pole resonator (146), wherein a direction in which the first line (line 151) is drawn out from the first-pole resonator (141) and a direction in which the second line (line 152) is drawn out from the last-pole resonator (146) are opposite to each other.
Method for manufacturing a superconducting LC-type resonator and superconducting resonator thus obtained
A method for manufacturing a superconducting LC-type resonator of the type including at least one high-resistivity substrate on which are printed an inductive meander, a first so-called lower electrode and a second so-called upper electrode arranged opposite the first so as to form together a capacitor connected in parallel with the inductive meander, as well as inductive coupling means dedicated to the resonator, in which a sacrificial aluminium layer is deposited between the first and second electrodes. Also disclosed is the superconducting LC-type resonator thus obtained and the use of such a resonator for detecting the noise of a millimetre photon.
Electromagnetic band gap structure and package structure
An electromagnetic bandgap structure includes a plurality of resonators. Each of the resonators includes a dielectric substrate, a patch conductor formed on an upper surface of the dielectric substrate, and a conductor layer formed on a lower surface of the dielectric substrate. The patch conductor and the conductor layer are electrically connected to each other by via holes penetrating the dielectric substrate. A plurality of long holes and are formed on the lower surface of the dielectric substrate. A long hole conductor layer is formed on an inner wall surface of the long holes and. The conductor layer and the long hole conductor layer are electrically connected to each other to thereby form an integral conductor surface. The via holes are electrically connected to the conductor surface in the long holes and.
WIRELESS NEUROMODULATION VIA MICROWAVE SPLIT RING RESONATOR
A system for neuromodulation includes a split-ring resonator (SRR) comprising a resonance circuit, the SRR being implantable in a cranial target site and a source of microwave signals, wherein the microwave signals are deliverable wirelessly to couple with the SRR to produce a localized electrical field, wherein the localized electrical field inhibits one or more neurons at the cranial target site with submillimeter spatial precision.
SCALABLE INTERCONNECTED QUANTUM ARCHITECTURE
A quantum circuit includes a quantum signal unit. There is a first quantum chip comprising a plurality of qubit devices and bi-directionally coupled to the quantum signal unit. A first quantum entangling unit is bi-directionally coupled to the quantum signal unit and configured to generate an entanglement between a first and a second qubit device on the first quantum chip via the quantum signal unit.
Circuit and Method of Providing Common Mode Suppression for Amplifier
A semiconductor device has an amplifier and common mode suppression (CMS) circuit formed on a common substrate. The CMS circuit has a first input and second input coupled for receiving an input signal and further has a first output coupled to a first input of the amplifier and a second output coupled to a second input of the amplifier to reduce common mode. The CMS circuit further has a ground plane, a first conductive trace disposed over the ground plane and coupled between the first input and first output, second conductive trace disposed over the ground plane and coupled between the second input and second output, and third conductive trace disposed over the ground plane with a first end of the third conductive trace coupled to the ground plane and a second end of the third conductive trace open circuit to form a resonator.
Printed Microstrip Filter
A printed film RF micros trip bandpass filter includes a plurality of resonators disposed on a dielectric substrate, first and second input/output (I/O) interfaces connected to corresponding first and second resonators flanking one or more intermediate resonators. Opposite ends of the one or more intermediate resonators are connected to a ground plane on an opposite side of the substrate by corresponding conductors. The intermediate resonators have an electrical wavelength that is one-half a wavelength of a center frequency of the filter and the first and second resonators can have an electrical wavelength that is nominally one-half the wavelength of the bandpass filter center frequency.
QUANTUM DEVICE
Provided is a quantum device capable of improving cooling performance. A quantum device includes a quantum chip configured to perform information processing using a quantum state, and an interposer on which the quantum chip is mounted, and the quantum chip is arranged inside a recess 31 formed in a sample stage having a cooling function, and a part of the interposer is in contact with the sample stage. The quantum chip may have a first surface mounted on the interposer and a second surface opposite to the first surface, and at least a part of the second surface may be in contact with an inner surface of the recess.
Wireless neuromodulation via microwave split ring resonator
A system for neuromodulation includes a split-ring resonator (SRR) comprising a resonance circuit, the SRR being implantable in a cranial target site and a source of microwave signals, wherein the microwave signals are deliverable wirelessly to couple with the SRR to produce a localized electrical field, wherein the localized electrical field inhibits one or more neurons at the cranial target site with submillimeter spatial precision.