A method of manufacturing a circuit board having waveguides including forming a waveguiding structure by injection molding. The waveguiding structure includes a plurality of waveguides arranged at intervals and at least one connecting portion connecting two adjacent waveguides. Each waveguide includes a waveguiding substrate and at least one protrusion on the waveguiding substrate. The connecting portion is removed to obtain at least two waveguides. A metal layer is formed to wrap the whole outer surface of each waveguide. A plurality of receiving grooves is formed to penetrate a wiring board. Each waveguide wrapped by the metal layer is embedded in one of the receiving grooves. The waveguides and the wiring board are fixed. A portion of the metal layer on a surface of each protrusion facing away from the waveguiding substrate is removed. A circuit board is also provided.

A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

The radar system includes a split-block assembly comprising a first portion and a second portion. The first portion and the second portion form a seam, where the first portion has a top side opposite the seam and the second portion has a bottom side opposite the seam. The system includes at least one port located on a bottom side of the second portion. Additionally, the system includes radiating elements located on the top side of the first portion, wherein the radiating elements are arranged in a plurality of arrays. Yet further, the system includes a set of waveguides in the split-block assembly configured to couple each array to at least one port. Furthermore, the split-block assembly is made from a polymer and where at least the set of waveguides, the at least one port, and the plurality of radiating elements include metal on a surface of the polymer.

A waveguide flange adapter includes a plate; an aperture positioned through the plate; and a plurality of holes arranged in a pattern in the plate and around the aperture. The plate is configured to operatively connect a first waveguide to a second waveguide such that the first waveguide and the second waveguide have a different pattern of holes on the waveguide flanges to one another. The pattern of the plurality of holes may be configured to align with connecting holes in each of the first waveguide and the second waveguide. At least some of the plurality of holes may extend through an entire thickness of the plate. The plate may include electrically-conductive material. The size and shape of the aperture may be complementary to a size and shape of each of the first waveguide and the second waveguide. At least some of the plurality of holes may be tapped or untapped.

The present invention relates to a cavity filter and a method of manufacturing the same, and particularly, to a cavity filter including one side cavity and the other side cavity required to have capacitive cross-coupling design, resonant bars respectively provided at centers of one side cavity and the other side cavity, and a vertical post for a notch extending from any one of the resonant bars and extending in a vertical direction in an inner wall that is a boundary between one side cavity and the other side cavity, in which the resonant bar, which is connected to the vertical post for a notch among the resonant bars, is integrated with the vertical post for a notch, thereby providing an advantage of easily manufacturing the cavity filter and easily performing capacitive cross-coupling design.

A multi-layer waveguide device, a multi-layer waveguide arrangement, and a method for production thereof, wherein the multi-layer waveguide comprises at least three horizontally divided layers assembled into a multi-layer waveguide. The layers are at least a top layer, an intermediate layer, and a bottom layer, wherein each layer has through going holes extending through the entire layer. The holes are arranged with an offset to adjacent holes of adjoining layers creating a leak suppressing structure.

This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.

An apparatus includes a tube including an inner surface, an inner diameter, and a length. The apparatus also includes a coil spring. The coil spring includes an outer surface, an outer diameter, and a plurality of coil elements arranged along a length of the coil spring. The coil spring can be positioned within the tube and the outer diameter of the coil spring can be less than the inner diameter of the tube. The coil spring can form a waveguide. Related methods of manufacture and systems are also described herein.

This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.

Waveguides and related assemblies for use, for example, in RADAR sensor assemblies and the like. In some embodiments, the waveguide may comprise a conductive member having a first plurality of posts arranged in a first row thereon. A second plurality of posts may be arranged in a second row on the conductive member to define a waveguide between the first plurality of posts and the second plurality of posts. One or more platforms may be provided to project at least a subset of the first plurality of posts and the second plurality of posts beyond at least a portion of the conductive member adjacent to the one or more platforms. A second conductive member, such as a cover, may be coupled to the conductive member such that the first and second pluralities of posts extend between the conductive member and the cover.