A method of producing a radio frequency member to construct a radio frequency confinement device based on a waffle iron structure includes providing an intermediate work of a plate shape or a block shape, the intermediate work including a main surface which is shaped as a plane or a curved surface and a plurality of rods extending away from the main surface. An interval between a side surface of one of the plurality of rods and a side surface of another rod that is adjacent to the one rod monotonically increases in a direction away from the main surface. The method also includes forming an electrically-conductive plating layer on the main surface and at least the side surface of the plurality of rods by immersing at least a portion of the intermediate work in plating solution.

Waveguides and methods for manufacturing a waveguide that include forming a first channel in a first layer of dielectric material, the first channel comprising one or more walls; forming a second channel in a second layer of dielectric material, the second channel comprising one or more walls; depositing electrically conductive material on the one or more walls of the first channel; depositing electrically conductive material on the one or more walls of the second channel; arranging the first layer adjacent to the second layer to form a stack with the first channel axially aligned with and facing the second channel; and heating the stack so that the conductive material on the one or more walls of the first channel and the conductive material on the one or more walls of the second channel connect to form the waveguide.

A method for producing a hollow conductor is specified. The hollow conductor has a first hollow-conductor section and a connecting section. The first hollow-conductor section contains a non-weldable aluminium alloy and the connecting section contains a weldable aluminium alloy. The method includes the step of: connecting the first hollow-conductor section to the connecting section by a laser-welding method.

A method of manufacturing a device is provided. The method includes forming a first cavity in a first substrate with the first cavity having a first depth. A second cavity is formed in a second substrate with the second cavity having a second depth. The first cavity and the second cavity are aligned with each other. The first substrate is affixed to the second substrate to form a waveguide substrate having a hollow waveguide with a first dimension substantially equal to the first depth plus the second depth. A conductive layer is formed on the sidewalls of the hollow waveguide. The waveguide substrate is placed over a packaged semiconductor device, the hollow waveguide aligned with a launcher of the packaged semiconductor device.

An apparatus includes a tube including an inner surface, an inner diameter, and a length. The apparatus also includes a coil spring. The coil spring includes an outer surface, an outer diameter, and a plurality of coil elements arranged along a length of the coil spring. The coil spring can be positioned within the tube and the outer diameter of the coil spring can be less than the inner diameter of the tube. The coil spring can form a waveguide. Related methods of manufacture and systems are also described herein.

A waveguide assembly for a radio frequency (RF) signal network can include a plurality of waveguides, wherein at least two of the plurality of waveguides are integrally formed with each other. A satellite payload can include the waveguide assembly, a method of manufacturing a waveguide assembly, and a method of manufacturing a signal network. Also provided is a waveguide connector having a flange, and a plurality of ports, wherein the flange can couple to a further waveguide connector, each port of the plurality of ports being configured to interface with a respective waveguide.

A radio frequency front end and an antenna front end may be separated from one another to maintain close proximity between a low noise amplifier and an antenna while achieving improved thermal regulation of a power amplifier. The radio frequency front end antenna front end may include a duplexing system that enables operation with a single electrical cable. Furthermore, where it is desired to transmit a radiofrequency signal via a waveguide, a flexible waveguide may be constructed with a distributed capacitance between waveguide protrusions.

An integral waveguide device herein includes a polarizer component comprising a waveguide and a dielectric slab, the dielectric slab configured to change a polarization of a signal passing through the waveguide. The integral waveguide device also includes a feed horn for conveying signals between the waveguide and a parabolic antenna. The waveguide of the polarizer and the feed horn are manufactured as an integral component with the feed horn disposed at a first end of the waveguide.

Microelectronic assemblies that include a lithographically-defined substrate integrated waveguide (SIW) component, and related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate portion having a first face and an opposing second face; and an SIW component that may include a first conductive layer on the first face of the package substrate portion, a dielectric layer on the first conductive layer, a second conductive layer on the dielectric layer, and a first conductive sidewall and an opposing second conductive sidewall in the dielectric layer, wherein the first and second conductive sidewalls are continuous structures.

A waveguide package and a method for manufacturing the same are disclosed. The waveguide package includes a package structure including a waveguide opened toward one side surface of a substrate, a semiconductor chip mounted on one surface of the package structure and configured to output an electrical signal to the waveguide. Since an interior of the waveguide is filled with air, electrical loss of the waveguide is minimized The cavity is formed by processing the substrate made of photosensitive glass. Accordingly, the waveguide may be accurately formed. An electronic circuit may also be formed at the waveguide package. Accordingly, it may be possible to provide a waveguide package enhanced in degree of integration.