A polycrystal having a physical property that enables an AC resistance value to drop sharply is used to reduce transmission loss of a high frequency signal being transmitted. A high frequency transmission device D1 is provided that includes a dielectric 100 and a transmission line 200 adapted for transmitting therethrough high frequency signals. At least part of the transmission line 200 is located on or inside the dielectric 100. At least part of the transmission line 200 is composed of a polycrystal composed of conductor fine particles. The polycrystal has a physical property such that, when a high frequency signal to be transmitted through the transmission line 200 is of frequencies within one or more specific frequency bands, the AC resistance value drops sharply.

Wideband waveguide to coaxial low loss signal couplers use an electro-magnetic wire loop inserted perpendicularly in a slot in the top cover of the waveguide transmission line. In order to adapt also to various power levels and associated receiver sensitivity, the coupling factor can be modified by controlling the penetration of the wire loop inside the waveguide cavity. Coupling and Directivity are approximately constant and track over the WR bandwidth up to WR-10. A calibration method allows full characterization of a coupler-tuner assembly.

A quasi-coaxial transmission line, a semiconductor package including the same and a method of manufacturing the same are disclosed. The quasi-coaxial transmission line includes a core, which is formed through an upper surface and a lower surface of a base substrate so as to transmit an electrical signal, and a shield, which is spaced apart from the core and which coaxially surrounds a side surface of the core, at least a portion of the shield being removed so as to form an open portion. The quasi-coaxial transmission line is capable of preventing distortion of an electrical signal at a portion thereof that is connected to an external circuit board and to reduce an area of a semiconductor package including the quasi-coaxial transmission line.

A conductive assembly may include a deformable substrate disposed around an axis, and a deformable conductor arranged on the deformable substrate. The substrate may be arranged to form a channel along the axis, and the deformable conductor may be arranged on the deformable substrate to form a waveguide. The deformable substrate, the first deformable conductor, and a second deformable conductor may be arranged to form a microstrip or a coaxial transmission line. A deformable transmission line may include a deformable substrate arranged in a substantially enclosed channel around an axis, a first deformable conductor arranged in a trace along the axis of the deformable substrate, and a second deformable conductor arranged on the deformable substrate to form a reference conductor for the first deformable conductor. A method of fabricating a deformable conductive assembly may include forming a deformable conductor on a deformable substrate, and disposing the deformable substrate around an axis.

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

A coaxial waveguide transducer includes: a waveguide having a substantially L shape formed of a first waveguide part and a second waveguide part arranged substantially orthogonal to each other; a stepwise step bend part formed in an outer corner part of an L-shaped bent part of the waveguide; a first conductor and a second conductor arranged in respective inner side walls of the waveguide in such a way that they are extended in a direction in which a central conductor of the coaxial line is extended and are positioned on a plane the same as that where the central conductor is provided; and a third conductor having one end connected to the central conductor and another end connected to one of the first conductor and the second conductor, the third conductor being arranged obliquely with respect to the direction in which the central conductor is extended.

Radiating cable (100; 100a; 100b; 100c; 100d; 100e) for radiating electromagnetic energy, comprising an inner conductor (110), an outer conductor (120) arranged radially outside of said inner conductor (110), and an isolation layer (130) arranged radially between said inner conductor (110) and said outer conductor (120), wherein said outer conductor (120) comprises one or more first openings (1202), and wherein said inner conductor (110) comprises a hollow waveguide (1100).

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.

The present invention relates to use of an enhanced performance ultraconductive copper composite cylindrical conduit. The ultraconductive copper composite cylindrical conduit has enhanced RF conductivity.

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.