The present invention relates to use of an enhanced performance ultraconductive copper composite cylindrical conduit. The ultraconductive copper composite cylindrical conduit has enhanced RF conductivity.

Embodiments may relate to a semiconductor package that includes a die and a package substrate. The package substrate may include one or more cavities that go through the package substrate from a first side of the package substrate that faces the die to a second side of the package substrate opposite the first side. The semiconductor package may further include a waveguide communicatively coupled with the die. The waveguide may extend through one of the one or more cavities such that the waveguide protrudes from the second side of the package substrate. Other embodiments may be described or claimed.

A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 m and 10 m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.

Techniques are disclosed for systems and methods to provide a magnetic materials additive manufacturing system (MMAMS) configured to form compact magnetic structures and/or devices. A MMAMS includes a controller and one or more dispensers configured to dispense magnetic material matrix in a high resolution pattern in order to form the compact magnetic structures and/or devices. The MMAMS receives a magnetic device design including a magnetic structure to be formed from a magnetic material matrix, where the magnetic material matrix is configured to be used in the MMAMS. The MMAMS receives magnetic material matrix and dispenses the magnetic material matrix to form the magnetic structure.

Disclosed herein are via-trace-via structures with improved alignment, and related devices and methods. For example, in some embodiments, an integrated circuit (IC) package substrate may include a conductive trace having a first surface and an opposing second surface; a first conductive via in a first dielectric layer, wherein the first conductive via is in contact with the first surface of the conductive trace; and a second conductive via in a second dielectric layer, wherein the second conductive via is in contact with the second surface of the conductive trace, wherein the second dielectric layer is on the first dielectric layer, and wherein the first conductive via, the second conductive via, and the conductive trace have a same width between 0.5 um and 25 um.

A coaxial waveguide transducer includes: a waveguide having a substantially L shape formed of a first waveguide part and a second waveguide part arranged substantially orthogonal to each other; a stepwise step bend part formed in an outer corner part of an L-shaped bent part of the waveguide; a first conductor and a second conductor arranged in respective inner side walls of the waveguide in such a way that they are extended in a direction in which a central conductor of the coaxial line is extended and are positioned on a plane the same as that where the central conductor is provided; and a third conductor having one end connected to the central conductor and another end connected to one of the first conductor and the second conductor, the third conductor being arranged obliquely with respect to the direction in which the central conductor is extended.

A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 m and 10 m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

A coaxial cable includes a center conductor layer; an insulator layer covering a periphery of the center conductor layer; an outer conductor layer covering a periphery of the insulator layer; a separator layer covering a periphery of the outer conductor layer; a radio wave absorbing resin layer covering a periphery of the separator layer; and an outer sheath covering a periphery of the radio wave absorbing resin layer. The radio wave absorbing resin layer is formed of a material in which a magnetic body is mixed into a resin, and the separator layer is formed by winding a tape-shaped member around the periphery of the outer conductor layer so as to overlap without a gap.

A method of producing a waveguide-to-coaxial adapter array includes applying solder paste to inner surfaces of throughholes of an electrical conductor, inserting coaxial connectors respectively in the throughholes from a first surface of the conductor so that cores of the throughholes respectively become located at the inner surfaces of the throughholes, inserting one or more fixtures including a flat surface in the throughholes from a second surface of the conductor that is opposite to the first surface, so that the flat surface of the fixture(s) contacts the cores of the coaxial connectors and that the cores of the coaxial connectors are held against the inner surfaces of the throughholes, connecting the cores of the coaxial connectors respectively to the inner surfaces of the throughholes by melting the solder paste, and disengaging the fixture(s) from the throughholes.