An electronic device is provided. The electronic device includes a first frame, a first opening formed in a first area of the first frame, a first antenna module, a cover that includes a first dielectric material and a second dielectric material and is disposed in the first area of the first frame, and a first wireless communication circuit. The first dielectric material includes an engagement groove, and the second dielectric material includes a protrusion corresponding to the engagement groove. The first dielectric material and the second dielectric material may come into contact as the protrusion of the second dielectric material engages with the engagement groove of the first dielectric material.

The invention relates to a cover element having a housing of a film that is formed and moulded between a front plate and a carrier plate and is used to represent multidimensional structures, the carrier plate being connected on the rear side to a heating plate, characterized in that the housing consists of an annular housing base and an annular housing front, and a circuit-board ring having LEDs and plugs is installed in the housing base.

Multi-sided antenna modules employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related antenna module fabrication methods. The multi-sided antenna module includes an integrated circuit (IC) die(s) disposed on a first side of the package substrate. The multi-sided antenna module further includes first and second substrate antenna layers disposed on respective first and second sides of the package substrate. The first substrate antenna layer includes a first antenna(s) disposed on the first side of the package substrate adjacent to the IC die(s). The second substrate antenna layer includes a second antenna(s) disposed on the second side of the package substrate opposite of the first side of the package substrate. In this manner, the multi-sided antenna module, including antennas on multiple sides of the package substrate, provides antenna coverage that extends from both sides of the package substrate to provide multiple directions of coverage.

An antenna system is on a first conductor, spaced apart from a second conductor and includes a first dielectric substrate, and a first metal layer and a second metal layer. Many first conductive structures are connected to the first metal layer and the second conductor. Many second conductive structures are connected to the first metal layer and the second metal layer. A second dielectric substrate includes a third horizontal surface, a first vertical surface and a second vertical surface. A frequency adjustment portion is on the third horizontal surface. A first matching portion and a second matching portion are on the second vertical surface. A first coupling distance is between the first matching portion and the first metal layer. A second coupling distance is between the second matching portion and the first metal layer. A signal source is connected to the second matching portion and the second metal layer.

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

A wireless communication system may include an electronic device having an antenna element. The antenna element may convey radio-frequency signals greater than 10 GHz across a dielectric housing wall. A dielectric matching structure may be interposed between the antenna element and the dielectric housing wall. The wireless communication system may include external equipment having an antenna element communicatively coupled to the electronic device antenna element to convey firmware testing, debugging, restore, and/or other data via a near-field wireless communication link. The external equipment may be configured to receive the electronic device at an opening. A dielectric matching structure may be provided at the external equipment between the dielectric housing wall and the external equipment antenna element. The interior surface of the dielectric housing wall may have planar, convex, or concave portions.

An emblem (30) (vehicle decorative part) includes a decorative main body (31) and a heater (55). The decorative main body (31) is configured to be attached to a vehicle at a front side in a transmission direction of millimeter waves from a millimeter wave radar to decorate the vehicle and has a millimeter wave transparency. The heater (55) has a heating element (57) that emits heat when energized. At least a part of the heating element (57) is located in a irradiation region (Z1) of the millimeter waves in the heater (55). As a millimeter wave attenuation reducing configuration that reduces attenuation of the millimeter waves passing through the heater (55), the heating element (57) is incorporated in the heater (55) in a condition where an area proportion of an area of a section of the heating element (57) that occupies the irradiation region (Z1) to an area of the irradiation region (Z1) is set such that an attenuation amount of the millimeter waves is less than or equal to a permissible value.

A gradient permittivity film comprises (a) a first permittivity layer comprising a first continuous matrix of a first material having a first relative permittivity (ε.sub.r1) and a second component having a second relative permittivity (ε.sub.r2) dispersed in the first continuous matrix, the first permittivity layer having a first effective layer relative permittivity (ε.sub.1) and a thickness (T.sub.1); and (b) a second permittivity layer having a second effective layer relative permittivity (ε.sub.2) and a thickness (T.sub.2) disposed on the first permittivity layer T.sub.1=0.8(t.sub.1) to 1.2(t.sub.1), where t.sub.1=(I); T.sub.2=0.8(t.sub.2) to 1.2 (T.sub.2), where T.sub.2=(II). $\begin{array}{cc}{t}_1=\frac{c}{4f\sqrt{{\epsilon }_1}}& \left(I\right)\end{array}$$\begin{array}{cc}{t}_2=\frac{c}{4f\sqrt{{\epsilon }_2}}& \left(\mathrm{II}\right)\end{array}$

Provided is a carrier-attached metal foil which has excellent carrier-releasability and excellent selective metal layer-etchability, and can achieve a reduction in transmission loss and resistance in a semiconductor package (for example, a millimeter-wave antenna substrate) manufactured using the same. The carrier-attached metal foil includes: (a) a carrier; (b) a release functional layer on the carrier and including (b1) an adhesion layer disposed closer to the carrier and having a thickness of more than 10 nm and less than 200 nm and (b2) a release assistance layer disposed farther from the carrier and having a thickness of 50 nm or more and 500 nm or less; and (c) a composite metal layer on the release functional layer and including (c1) a carbon layer disposed closer to the release assistance layer, and (c2) a first metal layer disposed farther from the release assistance layer and mainly composed of Au or Pt.

A broadband panel array antenna includes a polarization layer, a radiating layer and a feed layer which are sequentially stacked from top to bottom. The feed layer is used for converting a single path of TE10 mode signals into a plurality of paths of same-power in-phase TE10 mode signals and transmitting the plurality of paths of TE10 mode signals to the radiating layer. The radiating layer is used for radiating the plurality of paths of TE10 mode signals from the feed layer to a free space. The polarization layer is used for rotating the polarization direction of an electric field generated by the radiating layer to reduce the side lobe in an E-plane direction diagram and an H-plane direction diagram. The broadband panel array antenna has the advantages of being low in side lobe, high in gain and efficiency, and low in machining cost.