A method for constructing a plurality of ceramic layers by winding continuous ceramic filaments to prepare RF-transparent structures is provided. Dielectric properties of each layer of the plurality of ceramic layers are characterized by an inter-filament spacing, a filament count and thickness. Once the plurality of ceramic layers are constructed, a structure is removed from a winding surface, wherein the winding surface is a mandrel, infiltrated with a resin in a separate set up and fired.

The invention provides a chip including a package substrate, at least one subunit, and a radio frequency chip. Each subunit includes an end-fire antenna disposed on an upper surface of the package substrate. The end-fire antenna is electrically connected to the radio frequency chip through a feed line. The radio frequency chip is located on a lower surface of the package substrate. According to the millimeter-wave antenna chip provided in this application, the end-fire antenna may be lifted to the upper surface of the package substrate of the chip by using stacked metal via holes of the package substrate, and a height of the end-fire antenna relative to a peripheral component may be increased by using a thickness of the package substrate.

A communications device may include an RF device having an operating frequency range, and an antenna coupled to the RF device and being electrically small with respect to the operating frequency range of the RF device. The communications device may include an active capacitor coupled between the RF device and the antenna. The active capacitor may include a settable operating curve with a decreasing capacitance versus increasing frequency over a portion of the operating frequency range of the RF device. The communications device may further include a control circuit coupled to the active capacitor to set the settable operating curve.

A cover for at least one antenna emitting and/or sensing electromagnetic radiation in at least one first frequency band includes at least one first surface facing the antenna and at least one second surface averted to the antenna, and at least one first carrier layer into which hat least one heating element is embedded, the heating element being connected to a terminal at least partly extending from the first surface and/or being at least partly located on the first surface.

In one embodiment of the present disclosure, an antenna assembly includes a plurality of layers defining an antenna assembly including a plurality of PCB layers and a plurality of non-PCB layers, the antenna assembly having a top surface and a bottom surface, and adhesive coupling between the PCB layers and the non-PCB layers.

Disclosed is a decorative element for vehicles, which comprises: on the rear part thereof, an opaque resin base (8) and a camera, the resin base having a thickness that allows the camera (9) to be positioned; and on the front part thereof, a layer of transparent resin (2) on which two decorative layers, a discontinuous opaque layer (3) and a metallic-looking layer (4), are disposed, wherein the camera is placed facing one of the discontinuities of the opaque layer (3), and wherein the metallic-looking layer (4) comprises an alloy of Cr or Mo with Al, Mg, Ag or In. By means of the metallic-looking layer, color distortion is prevented, and the camera is concealed from an external observer.

A radio-frequency module includes a multilayer substrate, a first semiconductor device, and a second semiconductor device. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first semiconductor device includes a first power amplifier circuit. The second semiconductor device includes at least one of a low-noise amplifier circuit, a switching circuit, or a control circuit. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face.

In one example of the present disclosure, a radome assembly for use with an antenna assembly is described. The radome assembly may comprise a radome body portion having a first surface and a second surface, wherein the second surface is opposite the first surface, and wherein the radome body portion defines a portion of a housing for an antenna assembly. The radome assembly may further comprise a radome spacer portion extending from the second surface of the radome body portion, the radome spacer portion defining a plurality of cells that are formed from a plurality of cell walls, wherein at least two cell walls of the plurality of cell walls defining each cell of the plurality of cells are spaced apart from each other.

In one example, a housing for an antenna assembly is described. The housing may include a lower enclosure configured to be coupled to an upper structure to define an internal region. The housing may also include an internal cover configured to be coupled to the lower enclosure to create a first chamber and a second chamber within the internal region.

An antenna device includes a first insulation layer, a defected metal layer, a second insulation layer, and a plurality of radiators. The defected metal layer is disposed on the first insulation layer, and the defected metal layer has a plurality of recess features which are arranged with uniform pitches. The second insulation layer is disposed on the first insulation layer and the defected metal layer. The radiators are disposed on the second insulation layer, and each radiator has a feeding portion and a grounding portion.