Systems and methods for RF hazard protection are provided. In one embodiment, a RF protection coupler comprises: a first port to couple to an output of an RF source circuit; a second port to couple to an external RF load; a source side and load side RF switches, wherein the source side RF switch and the load side RF switch are each switch between a first and second states in response to a detected matting. In the first state the source and load side RF switches establish an electrical path between the first and second ports. In the second state: the source side RF switch couples the first port to an impedance load that is impedance matched to the output of the RF source circuit; the load side RF switch couples the second port to an electrical ground; and a gap between the switches electrically isolates the ports.

A wireless wearable device comprises a radiating system that contains at least a non-resonant element disposed in different arrangements within a radiating structure in the radiating system, featuring compact dimensions and an adequate performance when operating on a carrier living body.

The present invention provides an electronic device. The electronic device includes a mainboard, a metal frame, a display module, and a shield structure. The mainboard includes a radio frequency circuit. The metal frame is coupled to the radio frequency circuit, and configured to receive or transmit a radio frequency signal. The shield structure is located in the display module or on a side of the display module closer to the mainboard, and is connected to the display module. The shield structure includes a metal shield layer. The metal shield layer is insulated from the metal frame and the radio frequency circuit, and the metal shield layer can generate reflection between the metal frame and the display module, weaken field strength generated in the display module by radiated energy from the metal frame, and shield the energy radiated from the metal frame to the display module.

An electrocardiogram recording device can include a housing, a clip, a modem, and an antenna. The housing can contain RF shielding, which can be arranged to minimize RF signal transmissions in one direction while not limiting RF signal transmission in an opposite direction. The clip can be attached to the housing. An antenna can be integrated within the clip. The modem can be a cellular data modem.

According to an example embodiment, an electronic device includes: a housing including a front surface, a rear surface opposite to the front surface, and a side surface surrounding at least a portion of an internal space between the front surface and the rear surface, the side surface comprising a conductive material; a wireless communication circuit disposed in the internal space, and an antenna structure including an antenna electrically connected to the wireless communication circuit. The antenna structure includes, an antenna slit formed in an area of the side surface comprising the conductive material and having a longitudinal direction, a feeder configured to apply a current to the antenna slit, and a conductive member comprising a conductive material connected to the side surface to cover at least a portion of the antenna slit.

A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

An electronic device includes a housing including a first plate including a glass plate, a second plate facing the first plate, and a side surface surrounding a space between the first plate and the second plate, a display positioned inside the space and exposed through a first area of the first plate, an antenna structure at least partially overlapping a second area of the first plate when viewed from above the first plate and which is connected to the second area, and a processor.

An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier. The module includes a dielectric layer structure and an antenna radiation layer structure. The antenna radiation layer structure is embedded in the first dielectric layer structure. Further, an antenna inlay, a component carrier, and a manufacturing method are described.

An electronic device is provided. The electronic device includes a housing including a conductive part, a device substrate disposed in an inner space of the housing, an antenna structure, disposed in the inner space to form a directional beam and including a substrate, an array antenna including a plurality of antenna elements disposed on the substrate and a support bracket to support the substrate, an electrical connection member connecting the substrate to the device substrate, a conductive contact connecting the electrical connection member to the conductive part, a first wireless communication circuit disposed in the inner space and configured to transmit or receive a first wireless signal in a first frequency band through the antenna structure, and a second wireless communication circuit disposed on the device substrate and configured to transmit or receive a second wireless signal in a second frequency band through the conductive part.

Aspects of this disclosure relate to methods of radio frequency signal processing. A radio frequency signal is received at an antenna on a first side of a multi-layer substrate and a low noise amplifier is disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the low noise amplifier. The radio frequency signal is provided to and amplified by the low noise amplifier.