A semiconductor package includes: a lower package; and an upper package stacked on the lower package, wherein the lower package includes: a first redistribution structure; a semiconductor chip mounted on the first redistribution structure; a first molding layer surrounding the semiconductor chip on the first redistribution structure; and first vertical connection conductors disposed on the first redistribution structure and vertically passing through the first molding layer, wherein the upper package includes: a second molding layer disposed on the lower package; second vertical connection conductors vertically passing through the second molding layer and electrically connected to the first vertical connection conductors; and an antenna structure disposed on the second molding layer.

A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

An antenna device intended to be used in a communication system of a timepiece, including a substrate; a first antenna circuit made on the substrate and having first and second strands which are connected and having a proximal end and a distal end, extending in parallel, a second antenna circuit made on the substrate and having third and fourth strands which are connected and having a proximal end and a distal end, and extending in parallel, an electrical junction link joining the proximal ends of the first and third strands; a connection portion configured to be bent relative to the electrical junction link, and including a conductive connection which is connected to the electrical junction link and including an electromagnetic shielding of the conductive connection.

An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

An antenna device includes a first substrate, a second substrate, an antenna layer, and a redistribution layer. The first substrate has a first surface, a second surface opposite to the first surface, and an inclined sidewall adjoining the first and second surfaces. The second substrate is below the first substrate. The first surface of the first substrate faces toward the second substrate. The antenna layer is located on the first surface of the first substrate. The redistribution layer extends from the second surface of the first substrate to the second substrate along the inclined sidewall of the first substrate, and the redistribution layer has a first section in contact with an end of the antenna layer.

A device for the non-destructive probing of a sample by means of electromagnetic wave reflection includes a metal body as part of its frame. The metal body forms a lateral wall and a separating wall enclosing an interior space. On a first side of the metal body, a shielding structure forms a plurality of shielded chambers for receiving RF circuitry. Interior space faces the second side of the metal body. A first circuit board containing driver and receiver circuitry is mounted to the first side of the metal body, and a second circuit board containing an antenna structure is mounted to the second side thereof.

Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.

To suppress downward radiation of electromagnetic waves from an antenna unit.

An antenna unit to be used by being installed so as to face a window glass for a building, the antenna unit comprising a plurality of array antennas, wherein each of the plurality of array antennas has a plurality of radiating elements and at least one conductor situated on an interior side relative to the plurality of radiating elements, and where the effective wavelength of the plurality of array antennas at the operation frequency is λ, and an integer of 0 or more is n, the distance from the center of the upper radiating element among the plurality of radiating elements to the upper edge of the conductor in the up-and-down direction is (0.5+n)λ±0.22λ, as seen in a plan view of the antenna unit.

A printed board assembly (PBA) is provided. The PBA includes first printed circuit board (PCB), a second PCB disposed parallel to the first PCB and including a conductive area, a first interposer surrounding a space between the first PCB and the second PCB, and a wireless communication circuit, wherein the interposer may include a first partition wall structure configured to provide shielding for at least one electronic component disposed in the PBA, and a second partition wall structure connected to the first partition wall structure and including an dielectric material, the second partition wall structure including a conductive via configured to connect the first PCB and the second PCB, and the wireless communication circuit may transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via.