An integrated circuit (IC) includes a semiconductor substrate having a first surface and a second surface opposite the first surface. A through wafer trench (TWT) extends from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate. Dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region has a conductive transmit patch. An antenna is formed, at least in part, by the dielectric material in the TWT and the transmit patch in the interconnect region. The antenna is configured to transmit or receive electromagnetic radiation between the transmit patch and the second surface of the semiconductor substrate through the dielectric material within the trench.

An antenna capable of being joined to an antenna feed perpendicular to a ground plane includes a conductive radiator and a circular wafer surrounding the radiator. The radiator is tubular and has a longitudinal slot along the entire length thereof, parallel to the radiator's axis. The antenna feed can be connected across the slot. The wafer, made either or a conventional high dielectric isotropic material or of a uniaxial dielectric material, is spaced apart from the radiator and has a thickness approximately equal to the width of the slot, a diameter wherein a ratio of a diameter of the radiator to the diameter of the wafer is approximately 35%, and is located at a height above the ground plane equal to approximately 35% of the length of the radiator. The material of the wafer has a dielectric tensor with high polarizability in the axial direction and can be applied to preexisting antennas. This antenna gives enhanced bandwidth over ordinary slotted antennas.

An antenna includes a first conductor group including first conductors aligned in a first direction, a second conductor group, a third conductor group, first and second conductors, and a feed line configured to be electromagnetically connected to the first conductor. The second conductor group includes second conductors aligned in the first direction. The second conductor group is aligned with the first conductor group in a second direction intersecting the first direction. The third conductor group includes third conductors aligned in the first direction. The third conductor group is aligned with the first and second conductor groups in the second direction. The first conductor capacitively connects the first conductor group and the second conductor group. The first conductor capacitively connects the second conductor group and the third conductor group. The second conductor is electrically connected to the first conductor group, the second conductor group, and the third conductor group.

A tri-frequency multi-polarisation omnidirectional antenna comprising: a first plurality of curved electrically conductive strips arranged on the first face and being arranged to form an outer-loop; second plurality of curved electrically conductive strips arranged on the first face and being arranged to form an inner-loop; third plurality of curved electrically conductive strips arranged on the first face and being arranged to form middle-loop; a first power divider and a second power divider each connected to the strips of the inner-loop; a dielectric resonator comprising a first face, the first face arranged on the first face of the substrate; an electrically conductive probe being arranged at least partially within the dielectric resonator and extending at least part way along the symmetry axis.

An antenna module includes a first dielectric layer, an antenna layer, an electronic element and a first antenna tuning element. The first dielectric layer has an first dielectric surface and a second dielectric surface opposite to the first dielectric surface in a thickness direction. The antenna layer is formed in the first dielectric layer or formed on the first dielectric surface. The electronic element is disposed near to the second dielectric surface than to the first dielectric surface. The first antenna tuning element is formed on one of the first dielectric surface and the second dielectric surface and connected to the antenna layer. The first antenna tuning element and the electronic element are disposed in the thickness direction.

Antenna device which is suitable for wireless communications according to a 5G network standard, wherein the antenna device comprises, or consists of: i) a primary layer having a top side and a bottom side, the primary layer comprising a multitude of adjacent antenna units wherein each antenna unit has a respective electrically conductive antenna plate which is present at the top side of the primary layer, and ii) a dielectric resonator body which comprises, or consists of, a resonator base layer having a top side and a bottom side, which top side is provided with a multitude of adjacent resonator units, wherein the resonator base layer and the resonator units are made of dielectric material,
wherein the bottom side of the dielectric resonator body is provided on the top side of the primary layer, and wherein above the antenna plate of each antenna unit a corresponding resonator unit is present.

Method for use in wireless communications according to a 5G network standard, comprising the step of connecting a communication circuit to an antenna device.

Beam forming antennas for base station applications are configured as dielectric resonator antennas (DRAs) having arrays of dielectric resonator radiating elements (DRRE) therein with dual-polarized radiating properties. Each DRRE includes a dielectric radiating element (DRE) electromagnetically coupled by a resonant cavity to a respective cross-polarized feed network, which is responsive to first and second radio frequency (RF) input feed signals. Each resonant cavity may be configured as a polymer-filled resonant cavity, and each DRE may be configured as a cylindrically-shaped or dome-shaped dielectric radiating element.

An electromagnetic device includes: a first electromagnetic, EM, signal feed; a second EM signal feed disposed adjacent to the first EM signal feed; and, an elevated electrically conductive region disposed between and elevated relative to the first and second EM signal feeds.

An electronic device may be provided with a phased antenna array that radiates at a frequency greater than 10 GHz. The array may include a dielectric resonator antenna having a dielectric column with non-planar sidewalls that include planar portions and corrugated portions with grooves and ridges, that include sidewall steps, and/or that include angled sidewall portions. The dielectric resonator antenna may include a first dielectric column and a second dielectric column stacked on the first dielectric column. The second column may be narrower and may have a higher dielectric constant than the first column or may have the same width but a lower dielectric constant than the first column. This may serve to broaden the bandwidth of the dielectric resonator antenna relative to scenarios where the dielectric resonator antenna includes only a single dielectric resonating element having only planar sidewalls.

An electromagnetic, EM, apparatus, includes: a first portion having an EM signal feed; and a second portion disposed on the first portion, the second portion having a shaped metallized form having at least one shaped metallized cavity, the second portion further having a dielectric medium disposed within each of the at least one shaped metallized cavity such that respective ones of the dielectric medium has a 3D shape that conforms to a shape of a corresponding one of the at least one shaped metallized cavity.