A multi-band radiating array includes a reflector, a plurality of first radiating elements defining a first column on the reflector, a plurality of second radiating elements defining a second column on the reflector alongside the first column, and a plurality of third radiating elements defining a third column on the reflector between the first and second columns. The first radiating elements have a first operating frequency range, the second radiating elements have a second operating frequency range that is wider than the first operating frequency range, and the third radiating elements have a third operating frequency range that is lower than the second operating frequency range. Related radiating elements are also discussed.

An end cover includes an end cover plane perpendicular to a longitudinal axis of a radome and passes through a connection part of the end cover and the radome. Outlines of a cross section of the end cover includes a first spline curve between a first end point and a first intermediate point having at least one first curvature, and a second spline curve between a second intermediate point and a third intermediate point having at least one second curvature. The first intermediate point and the second intermediate point are not in the end cover plane. A distance between the first intermediate point and the end cover plane and a distance between the second intermediate point and the end cover plane are equal and not less than a distance between any point on the cross section of the end cover and the end cover plane.

A panel to enhance telecommunication signal range includes a base sheet. A reflector on a side of the base sheet reflects a telecommunication signal that is of a predetermined wavelength and that is incident on the base sheet. A reflected telecommunication signal is reflected in a predetermined direction, and the attenuation loss in the reflected telecommunication signal is less than a predetermined threshold. Methods to manufacture such panels are also described.

Methods and devices for integrating antennas fabricated using planar laminate processes. The method includes laminating one or more conductive layers to a first dielectric material layer, forming one or more holes through at least the first dielectric material layer, forming a monopole antenna through at least a first of the holes, attaching one or more integrated circuit dies to one of the conductive layer, and connecting the integrated circuit dies to the monopole antenna. The device can include a planar laminate integrated circuit module including one or more dielectric material layers, one or more integrated circuit die on a surface of or attached to the planar laminate integrated circuit module, and an integrated monopole antenna interfaced with the integrated circuit dies. The integrated monopole antenna is formed in a through hole of the planar laminate integrated circuit module, the through hole being formed through at least one of the dielectric material layers.

Embodiments of the present disclosure provide an antenna device and a base station comprising the same. The antenna device may comprise an antenna array with a radiation pattern including a main lobe and a back lobe; and a first reflector able to be configured to reflect a first part of energy of the back lobe to at least one direction different from a direction of the main lobe.

A semiconductor device package includes a substrate, an air cavity, a radiator, and a director. The substrate has a top surface. The air cavity is disposed within the substrate. The air cavity has a first sidewall and a second sidewall opposite to the first sidewall. The radiator is disposed adjacent to the first sidewall of the air cavity. The director is disposed adjacent to the second sidewall of the air cavity.

The present invention relates to: a communication technique for merging, with IoT technology, a 5G communication system for supporting a data transmission rate higher than that of a 4G system; and a system therefor. The present invention provides an antenna module comprising: an antenna array for radiating beams through a top surface thereof; a dielectric disposed to be spaced apart from the top surface of the antenna array by a first preset length; a first reflector comprising a metallic material, and disposed to be spaced apart from the bottom surface of the dielectric by a second preset length; and a second reflector comprising a metallic material and disposed in the partial region of the bottom surface, of the dielectric, which faces the top surface of the antenna array.

A transition structure for millimeter wave is provided. The transition structure includes a first layer signal element coupled to an end of a first transmission line and a plurality of first layer ground elements surrounding the end of the first transmission line equidistantly from the end of the first transmission line and disposed along two opposite sides of a strip body of the first transmission line equidistantly from the strip body of the first transmission line. The transition structure further includes an intermediate layer signal element coupled to the first layer signal element and a plurality of intermediate layer ground elements surrounding the intermediate layer signal element quasi-coaxially. A multilayer transition structure including a multilayer structure and the transition structure is also provided. Therefore, the problem of operating frequency caused by the thickness of the multilayer structure can be overcome, thereby increasing the resonance frequency of the multilayer structure.

Embodiments of a microelectronic assembly comprise a plurality of transceiver modules, each transceiver module including a first antenna; a printed circuit board (PCB); and a reflector module coupled to the PCB and separated from the plurality of transceiver modules by a space. The reflector module comprises: a substrate having a first side and an opposing second side, the first side being proximate to the plurality of transceiver modules, an antenna-array on the first side of the substrate, the antenna-array including a plurality of second antennas; a first integrated circuit (IC) die on the second side of the substrate; and a second IC die on the second side of the substrate. The first IC die comprises radio frequency (RF) switches configured to operate at electromagnetic frequencies between 20 kHz and 1 THz, and the second IC die comprises memory cell arrays and digital logic circuits.

Apparatus for Manufacture and In-Space Assembly of Antennas comprising: a prefabricated primary reflector center section; a trusselator truss assembler; a phased feed array; wherein said prefabricated reflector center section, trusselator, and phased feed array are fixedly connected to one another; a self-positioning and orienting tool; a truss extending from said trusselator; a secondary reflector attached to said truss; robotic arms; a nibbler end effector mounted on one of said robotic arms; a grapple end effector mounted on one of said robotic arms; a mold for casting a piece of a primary reflector; a power cube; a solar array providing power to said power cube; refabricator plus; and an ESPA ring.