An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, and a third radiation element. The feeding radiation element has a feeding point. The first radiation element is coupled to a first connection point on the feeding radiation element. The first radiation element includes a bending portion. The second radiation element is coupled to a second connection point on the feeding radiation element, and is adjacent to the bending portion of the first radiation element. The second radiation element is not parallel to the first radiation element. The third radiation element has a grounding point, and is coupled to a third connection point on the feeding radiation element. The third radiation element includes a first protruding portion and a second protruding portion. The first protruding portion and the second protruding portion of the third radiation element extend in different directions.

An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, and a third radiation element. The feeding radiation element has a feeding point. The first radiation element is coupled to a first connection point on the feeding radiation element. The first radiation element includes a bending portion. The second radiation element is coupled to a second connection point on the feeding radiation element, and is adjacent to the bending portion of the first radiation element. The second radiation element is not parallel to the first radiation element. The third radiation element has a grounding point, and is coupled to a third connection point on the feeding radiation element. The third radiation element includes a first protruding portion and a second protruding portion. The first protruding portion and the second protruding portion of the third radiation element extend in different directions.

This application relates to a device for signal transmission (e.g., radio frequency transmission) and a method for forming the device. For example, the method includes: depositing an insulating layer that includes polybenzobisoxazole (PBO) on a carrier; forming a backside layer including polyimide (PI) over the adhesive layer; forming a die-attach film (DAF) over the backside layer; forming one or more through-insulator via (TIV)-wall structures and one or more TIV-grating structures on the second backside layer, placing a die, such as a radio frequency (RF) integrated circuit (IC) die, on the DAF; encapsulating the die, the one or more TIV-wall structures, and the one or more TIV-grating structures, with a molding compound to form an antenna package including one or more antenna regions; and forming a redistribution layer (RDL) structure on the encapsulated package. The RDL structure can include one or more antenna structures coupled to the die. Each of the one or more antenna structures can be positioned over the one or more antenna regions.

A bowtie antenna arrangement including at least one bowtie structure including bowtie arm sections made of an electrically conducting material with each an end portion facing an end portion of another bowtie arm section, a base portion including a conducting ground plane, the bowtie structure being connected to a feeding arrangement. The bowtie arm sections are planar, made of a conducting sheet or plate element and are arranged in a bowtie arm section plane located in parallel with, at a first distance from a first side of the base portion, the, or each, bowtie arm structure being connected to a feeding port on a second side of the base portion.

An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, and a third radiation element. The feeding radiation element has a feeding point. The first radiation element is coupled to a first connection point on the feeding radiation element. The first radiation element includes a bending portion. The second radiation element is coupled to a second connection point on the feeding radiation element, and is adjacent to the bending portion of the first radiation element. The second radiation element is not parallel to the first radiation element. The third radiation element has a grounding point, and is coupled to a third connection point on the feeding radiation element. The third radiation element includes a first protruding portion and a second protruding portion. The first protruding portion and the second protruding portion of the third radiation element extend in different directions.

An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, and a third radiation element. The feeding radiation element has a feeding point. The first radiation element is coupled to a first connection point on the feeding radiation element. The first radiation element includes a bending portion. The second radiation element is coupled to a second connection point on the feeding radiation element, and is adjacent to the bending portion of the first radiation element. The second radiation element is not parallel to the first radiation element. The third radiation element has a grounding point, and is coupled to a third connection point on the feeding radiation element. The third radiation element includes a first protruding portion and a second protruding portion. The first protruding portion and the second protruding portion of the third radiation element extend in different directions.

An antenna device includes a substrate, a first antenna element extending in a direction perpendicular to a first surface of the substrate and functioning as a monopole antenna, a second antenna element provided adjacent to the first antenna element, extending in the direction perpendicular to the first surface of the substrate, and functioning as a monopole antenna, a ground layer provided in or on the substrate, a connection wire provided in or on the substrate and connecting the first antenna element and the second antenna element to each other, a power feeding line provided in or on the substrate and connected to the connection wire, and a first reflector provided in a direction in which the first antenna element and the second antenna element are adjacent to each other and facing the first antenna element and the second antenna element.

An antenna device includes a substrate, a first antenna element extending in a direction perpendicular to a first surface of the substrate and functioning as a monopole antenna, a second antenna element provided adjacent to the first antenna element, extending in the direction perpendicular to the first surface of the substrate, and functioning as a monopole antenna, a ground layer provided in or on the substrate, a connection wire provided in or on the substrate and connecting the first antenna element and the second antenna element to each other, a power feeding line provided in or on the substrate and connected to the connection wire, and a first reflector provided in a direction in which the first antenna element and the second antenna element are adjacent to each other and facing the first antenna element and the second antenna element.

The present disclosure relates to antenna. One example antenna includes a radiating element, a reflecting element, and a radio frequency coaxial cable. The radiating element and the reflecting element are located on a same plane, and the radiating element is connected to the radio frequency coaxial cable. The reflecting element is of a comb structure, the comb structure includes at least two comb teeth, sizes of all the comb teeth are the same, intervals between every two adjacent comb teeth are the same, and a comb-like opening face of the reflecting element is opposite to the radiating element.

A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).